Abstract
Using finite-element analysis, we have developed a metrology simulation to model errors in the measurement of the Seebeck coefficient. This physical parameter is the constant of proportionality relating the electric potential generated across a conductor to the applied thermal gradient. Its measurement requires careful attention to the electrical and thermal contact interfaces. Furthermore, it is essential that the electric potential and temperature difference be acquired at the same time and at the same location. We have performed Seebeck coefficient measurement simulations to quantitatively explore the effect of temporal perturbation to the voltage and temperature correspondence, by comparing simultaneous and staggered data acquisition techniques under the quasi-steady-state condition. Using a similar method, we have developed an error model to explore the effect of misalignment between the voltage and temperature probes on the measurement of the Seebeck coefficient. This approach enables the exploration of experimentally inaccessible data spaces under ideal conditions.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
A.F. Ioffe, Semiconductor Thermoelements and Thermoelectric Cooling (London: Infosearch Ltd., 1957).
H.J. Goldsmid, Electronic Refrigeration (London: Pion Limited, 1986).
C. Wood, Rep. Prog. Phys. 51, 459 (1988).
G.D. Mahan, Solid State Physics, vol. 51, ed. Henry Ehrenreich and Frans Spaepen (Academic Press, San Diego, 1998), p. 81.
G.S. Nolas, J. Sharp, and H.J. Goldsmid, Thermoelectrics: Basic Principles and New Materials Developments (New York: Springer, 2001).
D.M. Rowe, ed., Thermoelectrics Handbook (Boca Raton, FL: CRC, 1995).
M.G. Kanatzidis, S.D. Mahanti, and T.P. Hogan, ed., Chemistry, Physics, and Materials Science of Thermoelectric Materials: Beyond Bismuth Telluride (New York, NY: Plenum, 2003).
J. Martin, T. Tritt, and C. Uher, J. Appl. Phys. 108, 121101 (2010).
C. Uher, Nav. Res. Rev., TE Mater. XLVIII, 44 (1996)
T.M. Tritt, Materials Research Society Symposium Proceedings, TE Materials, New Directions and Approaches, vol. 478, ed. T.M. Tritt, M. Kanazidis, G. Mahan, and H.B. Lyons, Jr. (Materials Research Society, Pittsburgh, 1997), p. 25.
T.M. Tritt, and V. Browning, Recent Trends in TE Materials Research I, Semiconductors and Semimetals, vol. 69, ed. T.M Tritt (Academic, San Diego, 2001), pp. 25–50.
A.T. Burkov, Thermoelectrics Handbook: Macro to Nano (Boca Raton, FL: CRC, 2005), pp. 1–22.
T.M. Tritt, Thermoelectrics Handbook: Macro to Nano (Boca Raton, FL: CRC, 2005), pp. 1–23.
J. Martin, J. Res. NIST 117, 168 (2012).
E.E. Antonova and D.C. Looman, Proceedings of the International Conference on Thermoelectrics 2005 (2005), p. 200.
M. Jaegle, Proceedings of the European Conference on Thermoelectrics 2007, Odessa, (2007), p. 222.
D. Ebling, M. Jaegle, M. Bartel, A. Jacquot, and H. Böttner, J. Electron. Mater. 38, 1456 (2009).
L.D. Landau and E.M. Lifshitz, Electrodynamics of Continuous Media, 2nd ed. (Oxford: Butterworth-Heinemann, 1984).
F. Schaffler, Properties of Advanced Semiconductor Materials, ed. M.E. Levinshtein, S.L. Rumyantsev, and M.S. Shur (New York, NY: Wiley, 2001), p. 151.
A.J. Minnich, H. Lee, X.W. Wang, G. Joshi, M.S. Dresselhaus, Z.F. Ren, G. Chen, and D. Vashaee, Phys. Rev. B 80, 155327 (2009).
G.R. Caskey, D.J. Sellmyer, and L.G. Rubin, Rev. Sci. Instrum. 40, 1280 (1969).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Martin, J. Error Modeling of Seebeck Coefficient Measurements Using Finite-Element Analysis. J. Electron. Mater. 42, 1358–1364 (2013). https://doi.org/10.1007/s11664-012-2212-5
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-012-2212-5