Near-eutectic Sn-Ag-Cu samples were produced in different sizes and geometries, with different solidification temperatures. The Sn grain morphologies of samples were characterized and found to be correlated with the sample solidification temperature; the lower the solidification temperature, the higher the degree of interlacing observed. These Sn grain morphologies were observed to be consistent with a simple model that envisions the nucleus in an undercooled Sn-Ag-Cu liquid to be Sn atoms clustered around a Ag atom in a hexagonal configuration that allows Sn to grow epitaxially on each of its surfaces. At intermediate degrees of undercooling, a mixed Sn grain morphology is observed, with the interlaced portion associated with the region closer to Sn nucleation in these samples.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
M. Kerr and N. Chawla, Acta Mater. 52, 4527 (2004).
T.R. Bieler, H. Jiang, L.P. Lehman, T. Kirkpatrick, and E.J. Cotts, in 56th IEEE transactions on components and packaging technology, vol. 31 (2006), 370 pp.
B. Arfaei, Y. Xing, J. Woods, J. Wolcotts, P. Tumne, P. Borgesen, and E. Cotts, in 58th electronic components and technology conference (2008), 459 pp.
M. Lu, D.Y. Shih, P. Lauro, C. Goldsmith, and D.W. Henderson, Appl. Phys. Lett. 92, 211909 (2008).
K. Lee, K.S. Kim, Y. Tsukada, K. Suganuma, K. Yamanaka, S. Kuritani, and M. Ueshima, J. Mater. Res. 26, 467 (2011).
G. Powell, G. Colligan, V. Surprenant, and A. Urquhart, Metall. Mater. Trans. A 8, 971 (1977).
A. Hellawell and P.M. Herbert, Proc. R. Soc. Lond. A 269, 560 (1962).
F. Weinberg and B. Chalmers, Can. J. Phys. 30, 488 (1952).
L.P. Lehman, S.N. Athavale, T.Z. Fullem, A.C. Giamis, R.K. Kinyanjui, M. Lowenstein, K. Mather, R. Patel, D. Rae, J. Wang, Y. Xing, L. Zavalij, P. Borgesen, and E.J. Cotts, J. Electron. Mater. 33, 1429 (2004).
L.P. Lehman, Y. Xing, T.R. Bieler, and E.J. Cotts, Acta Mater. 58, 3546 (2010).
B. Arfaei and E. Cotts, J. Electron. Mater. 38, 2617 (2009).
P. Borgesen, T. Bieler, L. Lehman, and E. Cotts, MRS Bull. 32, 360 (2007).
B. Arfaei, M. Benedict, and E.J. Cotts, unpublished.
D.N. Lee, K.-h. Kim, Y.-g. Lee, and C.-H. Choi, Mater. Chem. Phys. 47, 154 (1997).
J. Warner and J. Verhoeven, Metall. Mater. Trans. B 3, 1001 (1972).
S.E. Battersby, R.F. Cochrane, and A.M. Mullis, J. Mater. Sci. 34, 2049 (1999).
J. Gong, C. Liu, P.P. Conway, and V.V. Silberschmidt, Scripta Mater. 61, 682 (2009).
A.M. Mullis, K.I. Dragnevski, and R.F. Cochrane, Mater. Sci. Eng. A 375–377, 157 (2004).
T. Haxhimali, A. Karma, F. Gonzales, and M. Rappaz, Nat. Mater. 5, 660 (2006).
C.F. Lau and H.W. Kui, Acta Metall. Mater. 41, 1999 (1993).
S. O’Hara, Acta Metall. 15, 231 (1967).
V.O. Esin, G.N. Pankin, and R.H. Nasyrov, Sov. Phys. Crystallogr. 18, 246 (1973).
A. Rosenberg and W.C. Winegard, Acta Metall. 2, 2242 (1954).
J.H. Hollomon and D. Turnbull, Prog. Metal Phys. 4, 333 (1953).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Arfaei, B., Kim, N. & Cotts, E. Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature. J. Electron. Mater. 41, 362–374 (2012). https://doi.org/10.1007/s11664-011-1756-0
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-011-1756-0