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Fabrication of Nickel/Gold Multilayered Shells on Polystyrene Bead Cores by Sequential Electroless Deposition Processes

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Core-shell conductive beads composed of a polystyrene (PS) core and a metallic shell of nickel-gold were investigated to identify the metal-polymer interface and the electromechanical response under a large deformation. Using dispersion polymerization, the average PS bead diameter was controlled to between 1.5 μm and 4.1 μm by adjusting the water and initiator concentrations, to give a monodispersed particle size distribution. In the electroless deposition processes of Ni followed by gold, the Ni-P shell was initially formed with a thickness of 43 nm, part of which was replaced by gold to give Ni-P and Au shell layers with thicknesses of 39 nm and 43 nm, respectively, as confirmed by transmission electron microscopy (TEM) observation. The electromechanical indentation test of a single core-shell bead showed that its resistance was 9.8 Ω/bead at a compressive deformation of 35%.

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References

  1. L. Babes, B. Denizot, G. Tanguy, J.J.L. Jeune, P. Jallet, J. Colloid Interface Sci. 212, 474 (1999) doi:10.1006/jcis.1998.6053

    Article  CAS  Google Scholar 

  2. O.D. Velev, E.W. Kaler, Langmuir. 15, 3693 (1999) doi:10.1021/la981729c

    Article  CAS  Google Scholar 

  3. F. Fleischhaker, R. Zentel, Chem. Mater. 17, 1346 (2005) doi:10.1021/cm0481022

    Article  CAS  Google Scholar 

  4. J.-H. Lee, D.O. Kim, G.S. Song, Y. Lee, S.B. Jung, J.-D. Nam, Macromol. Rapid Commun. 28, 634 (2007) doi:10.1002/marc.200600757

    Article  CAS  Google Scholar 

  5. A.K. Jadoon, B. Ralph, P.R. Hornsby, J. Mater. Process. Technol. 152, 257 (2004) doi:10.1016/j.jmatprotec.2003.10.005

    Article  CAS  Google Scholar 

  6. N.R. Basavanhally, D.D. Chang, and B.H. Cranston, Proceedings of Electronic Component and Technology Conference (May, 1992), pp. 19–20, 487–491.

  7. W.-S. Kwon, K.W. Paik, Int. J. Adhes. Adhes. 24, 135 (2004) doi:10.1016/j.ijadhadh.2003.07.003

    Article  CAS  Google Scholar 

  8. J. Liu, Mater. Technol. 10, 247 (1995)

    Google Scholar 

  9. A.J. Paine, W. Luymes, J. Mcnulty, Macromolecules. 23, 3104 (1990) doi:10.1021/ma00214a012

    Article  CAS  Google Scholar 

  10. K. Matyjaszewski and T.P. Davis, Dispersion and precipitation polymerization, in Radical Polymerization Handbook, Wiley, New York, 1975, p XV/856

    Google Scholar 

  11. R.R. Tummala, Fundamentals of Microsystems Packaging. (McGraw-Hill, New York, 2001), p 739

    Google Scholar 

  12. V.G. Pol, D.N. Srivastava, O. Palchik, V. Palchik, M.A. Slifkin, A.M. Weiss et al., Langmuir. 18, 3352 (2002) doi:10.1021/la0155552

    Article  CAS  Google Scholar 

  13. G. Kaltenphth, M. Himmelhaus, L. Slansky, F. Caruso, M. Grunze, Adv. Mater. 15, 1113 (2003) doi:10.1002/adma.200304834

    Article  Google Scholar 

  14. M. Datta, T.O. Saka, and J.W. Schultze, Microelectronic Packaging. (New York, CRC Press, 2004), p. 8∼20

    Google Scholar 

  15. G.H. Yang, E.T. Kang, K.G. Neoh, Langmuir. 17, 211 (2001) doi:10.1021/la0009689

    Article  CAS  Google Scholar 

  16. B.J. Meenan, N.M.D. Brown, J.W. Wilson, Appl. Surf. Sci. 74, 221 (1994) doi:10.1016/0169-4332(94)90003-5

    Article  CAS  Google Scholar 

  17. A.J. Paine, J. Colloid Interface Sci. 138, 157 (1989) doi:10.1016/0021-9797(90)90191-P

    Article  Google Scholar 

  18. B. Thomson, A. Rudin, and G. Lajoie, J. Appl. Polym. Sci. 59, 2009 (1996). doi :10.1002/(SICI)1097-4628(19960328)59:13<2009::AID-APP6>3.0.CO;2-L.

  19. M.A. Awan, V.L. Dimonie, and M.S. El-Aasser, J. Polym. Sci. Pol. Chem. 34, 2651 (1996). doi :10.1002/(SICI)1099-0518(19960930)34:13<2651::AID-POLA10>3.0.CO;2-B.

  20. S.E. Shim, S. Yang, S. Choe, J. Polym. Sci. Pol Chem. 42, 3967 (2004) doi:10.1002/pola.20188

    Article  CAS  Google Scholar 

  21. J.-S. Song, F. Tronc, M.A. Winnik, J. Am. Chem. Soc. 126, 6562 (2004) doi:10.1021/ja048862d

    Article  CAS  Google Scholar 

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Acknowledgements

This work was supported by Grant No. R012006000103480 from the Basic Research Program of the Korea Science & Engineering Foundation. We also appreciate the instrumental and technical support provided by the GRRC program from Gyeonggi Province and Local Government Initiated R&D Program (Project No. 2004-0693-200) of the Korea Ministry of Commerce, Industry and Energy, in conjunction with Gyeonggi Province.

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Authors and Affiliations

  1. Department of Polymer Science and Engineering, Sungkyunkwan University, 300 Chunchun-dong, Jangan-gu, Suwon, 440-746, South Korea

    Jun-Ho Lee, Jun Suk Oh, Pyong Chan Lee, Dong Ouk Kim & Jae-Do Nam

  2. Department of Chemical Engineering, Sungkyunkwan University, 300 Chunchun-dong, Jangan-gu, Suwon, 440-746, South Korea

    Youngkwan Lee

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  1. Jun-Ho Lee
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  2. Jun Suk Oh
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Correspondence to Jae-Do Nam.

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Lee, JH., Oh, J.S., Lee, P.C. et al. Fabrication of Nickel/Gold Multilayered Shells on Polystyrene Bead Cores by Sequential Electroless Deposition Processes. J. Electron. Mater. 37, 1648–1652 (2008). https://doi.org/10.1007/s11664-008-0503-7

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