Abstract
In an attempt to develop a fluxless reflow solder bumping process, the effects of processing variables, which include energy input rate and time, and the shape of solder disk on the microstructure of the solder/Cu pad interface and the shear strength of the joints were investigated. It was demonstrated that a proper combination of the variables could lead to the formation of a spherical solder bump with shear strength comparable to that formed via the conventional reflow soldering process. In addition, the kinetics of Cu pad dissolution into the solder during laser heating was modeled numerically to elucidate intermetallic formation mechanism at the solder/Cu pad interface.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
E. Semerad, L. Musiejovsky, and J. Nicolics, J. Mater. Sci. 28, 5065 (1993).
R.W. Messler, Jr. and D.L. Millard, Welding J. 73, 43 (1994).
W. Yang, R.W. Messler, Jr., and L.E. Felton, Welding J. (Research Suppl.), 74, 224-s (1995).
A. Flanagan, A. Conneely, T.J. Glynn, and G. Lowe, J. Mater. Process. Technol. 56, 531 (1996).
L. Dorn, F. Herbert, S. Jafari, and T. Schubert, Trans. ASME 119, 789 (1997).
U. Brinkmann, Laser Focus World 34, 24 (1998).
P.A. Moskowitz and A. Davidson, J. Vac. Sci. Technol. A3, 780 (1985).
P.A. Moskowitz and H. Yeh, J. Vac. Sci. Technol. 4, 838 (1986).
K. Mizuishi, M. Tokuda, and Y. Fujita, IEEE Trans. Comp. Hybrids Manuf. Technol. 11, 447 (1988).
N. Koopman and S. Nangalia, Flip Chip Technologies, ed. J.H. Lau (New York: McGraw-Hill, 1996), p. 83.
Y-C Chen, W.W. So, and C.C. Lee, IEEE Trans. Comp. Hybrids Manuf. Technol. (A) 20, 46 (1997).
K-I Tango and J. Shibata, Advances in Electronic Packaging 1997, Proc. INTERPACK’97, ed. E. Suhir, M. Shiratori, Y.C. Lee, and G. Subbarayan (New York: ASME, 1997), p. 1053.
D.R. Frear, F.M. Hosking, D.M. Keicher, and H.C. Peebles, Materials for Electronic Packaging, ed. D.D.L. Chung (Boston: Butterworth-Heinemann, 1995), p. 79.
J.H. Lee, Y.H. Lee, and Y.S. Kim, Scripta Mater., Accepted for publication.
H.K. Kim, H.K. Liou, and K.N. Tu, Appl. Phys. Lett. 66, 2337 (1995).
J. Crark, The Mathematics of Diffusion (Oxford: Oxford Science Publications, 1975), p. 141.
Y. Shoji, S. Uchida, and T. Ariga, Welding J. (Research Suppl.) 60, 19-s (1981).
J.R. Weeks and D.H. Gurinsky, Seminar from the 39 th National Metal Congress and Exposition (Materials Park, OH: The American Society of Metals, 1958), p. 106.
M. Schaefer, W. Laub, J.M. Sabee, and R.A. Fournelle, J. Electron. Mater. 25, 992 (1996).
N. Saunders and A.P. Miodownik, Binary Alloy Phase Diagrams, ed. T.B. Massalsk, H. Okamoto, P.R. Subramanian, and L. Kacprzak, (Materials Park, OH: ASM International, 1990), p. 1481.
J.H. Lee, D.J. Park, J.T. Moon, Y.H. Lee, and Y.S. Kim, J. Electron. Mater. submitted for publication.
Author information
Authors and Affiliations
Additional information
Jointly appointed by CAAM at POSTECH
Rights and permissions
About this article
Cite this article
Lee, JH., Park, D., Moon, JT. et al. Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering. J. Electron. Mater. 29, 1153–1159 (2000). https://doi.org/10.1007/s11664-000-0006-7
Received:
Issue Date:
DOI: https://doi.org/10.1007/s11664-000-0006-7