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High-cycle fatigue of nickel-based superalloy ME3 at ambient and elevated temperatures: Role of grain-boundary engineering

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Abstract

High-cycle fatigue (HCF), involving the premature initiation and/or rapid propagation of cracks to failure due to high-frequency cyclic loading, remains a principal cause of failures in gas-turbine propulsion systems. In this work, we explore the feasibility of using “grain-boundary engineering” as a means to enhance the microstructural resistance to HCF. Specifically, sequential thermomechanical processing, involving alternate cycles of strain and annealing, was used to increase the fraction of “special” grain boundaries and to break up the interconnected network of “random” boundaries, in a commercial polycrystalline Ni-based superalloy (ME3). The effect of such grain-boundary engineering on the fatigue-crack-propagation behavior of large (∼8 to 20 mm), through-thickness cracks at 25 °C, 700 °C, and 800 °C was examined. Although there was little influence of an increased special boundary fraction at ambient temperatures, the resistance to near-threshold crack growth was definitively improved at elevated temperatures, with fatigue threshold stress intensities some 10 to 20 pct higher than at 25 °C, concomitant with a lower proportion (∼20 pct) of intergranular cracking.

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Authors and Affiliations

  1. the Department of Materials Science and Engineering, University of California, 96720, Berkeley, CA

    Yong Gao (Graduate Student) & R. O. Ritchie (Professor)

  2. the Lawrence Livermore National Laboratory, 94550, Livermore, CA

    Mukul Kumar (Member of the Scientific Staff)

  3. the Materials Science Division, Lawrence Berkeley National Laboratory, 94720, Berkeley, CA

    R. K. Nalla (Postdoctoral Research Fellow)

Authors
  1. Yong Gao
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  2. R. O. Ritchie
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  3. Mukul Kumar
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  4. R. K. Nalla
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Gao, Y., Ritchie, R.O., Kumar, M. et al. High-cycle fatigue of nickel-based superalloy ME3 at ambient and elevated temperatures: Role of grain-boundary engineering. Metall Mater Trans A 36, 3325–3333 (2005). https://doi.org/10.1007/s11661-005-0007-5

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  • DOI: https://doi.org/10.1007/s11661-005-0007-5

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