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Single Cu nanowire assembled by microdroplet dielectrophoresis on ultrahigh tensible microelectrodes

  • Article
  • Mechanical Engineering
  • Published:
Chinese Science Bulletin

Abstract

At present, study on dynamic tensile properties and atomic chain fabrication of single nanowire, for understanding its dynamic tensile properties and unique physical properties of atomic chain to fabricate atom scale devices, is one of frontier research issues in nanoscale science. However, how to assemble single nanowire on a tensible microstructure becomes one of the most difficult problems, which severely restricts the development of this research field. In this paper, after the ultrahigh tensible microelectrode chip is fabricated by MEMS technology, hexamethyldisilazane is utilized to improve hydrophobicity of the chip, and then a microdroplet dielectrophoresis experimental platform and technology is developed to assemble single nanowire on the sensible microelectrode. Experimental results show that accurate and efficient assembly of single Cu nanowire is realized, which contribute greatly to the further research of dynamic tensile properties and atomic chain fabrication. And for guiding the assembly experiments, finite element technology is also utilized to analyze the local microelectro field around the microelectrodes during dieletrophoresis experiments.

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Acknowledgments

This work was supported by the National Natural Science Foundation of China (51375477 and 61375091) and the CAS FEA International Partnership Program for Creative Research Teams.

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Authors and Affiliations

  1. State Key Laboratory of Robotics, Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang, 110016, China

    Chaolei Huang, Xiaojun Tian, Jie Liu & Zaili Dong

  2. University of Chinese Academy of Sciences, Beijing, 100049, China

    Chaolei Huang

  3. Science and Technology on Micro-system Laboratory and State Key Laboratories of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, 200050, China

    Hongjiang Zeng, Tie Li & Yuelin Wang

Authors
  1. Chaolei Huang
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  2. Hongjiang Zeng
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  3. Xiaojun Tian
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  4. Jie Liu
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  5. Zaili Dong
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  6. Tie Li
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  7. Yuelin Wang
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Corresponding author

Correspondence to Xiaojun Tian.

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Huang, C., Zeng, H., Tian, X. et al. Single Cu nanowire assembled by microdroplet dielectrophoresis on ultrahigh tensible microelectrodes. Chin. Sci. Bull. 59, 577–584 (2014). https://doi.org/10.1007/s11434-013-0065-9

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  • DOI: https://doi.org/10.1007/s11434-013-0065-9

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