Skip to main content
Log in

Characteristics of exhaust gas, liquid products, and residues of printed circuit boards using the pyrolysis process

  • Area 6 • Analysis of Pyrolysis Products • Research Articles
  • Published:
Environmental Science and Pollution Research Aims and scope Submit manuscript

Abstract

Introduction

The pyrolytic method was employed to recycle metals and brominated compounds blended into printed circuit boards (PCBs).

Methods

PCBs were crushed into pieces 4.0–4.8 mm in size, and the crushed pieces were pyrolyzed at temperatures ranging from 200 to 500°C. The compositions of pyrolytic residues, liquid products, and exhaust were analyzed by inductively coupled plasma atomic emission spectrometer, inductively coupled plasma mass spectrometry, and gas chromatography–mass spectrometry. Pyrolytic exhaust was collected by an impinger system in an ice bath cooler to analyze the composition fraction of the liquid product, and uncondensable exhaust was collected for gas constituent analysis.

Results

Phenol, methyl-phenol, and bromo-phenol were attributed mainly to the liquid product. Metal content was low in the liquid product. In addition, CO, CO2, CH4, and H2 were the major components of pyrolytic exhaust.

Conclusions

Brominated and chlorinated compounds—i.e., dichloromethane, trans-1,2 dichloroethylene, cis-1,2 dichloroethylene, 1,1,1-trichloroethane, tetrachloromethane, bromophenol, and bromoform—could be high, up to the several parts per million (ppm) level. Low molecular weight volatile organic compounds (VOCs)—i.e., methanol, acetone, ethyl acetate, acrylonitrile, 1-butene, propene, propane, and n-butane—contributed a large fraction of VOCs. The concentrations of toluene, benzene, xylene, ethylbenzene, and styrene were in the ppm range.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3

Similar content being viewed by others

References

  • Allian A, Sansoni B (1985) A review on activation analysis of air particulate matter. Radioanal J Nucl Chem 89:191–275

    Article  Google Scholar 

  • Balabanovich AI, Hornung A, Merz D, Seifert H (2004) The effect of a curing agent on the thermal degradation of fire retardant brominated epoxy resins. Polym Degrad Stabil 85:713–723

    Article  CAS  Google Scholar 

  • Barontini F, Cozzani V, Marsanich K, Raffa V, Petarca L (2004a) An experimental investigation of tetrabromobisphenol A decomposition pathways. J Anal Appl Pyrolysis 72:41–53

    Article  CAS  Google Scholar 

  • Barontini F, Marsanich K, Petarca L, Cozzani V (2004b) The thermal degradation process of tetrabromobisphenol A. Ind Eng Chem Res 43:1952–1961

    Article  CAS  Google Scholar 

  • Barontini F, Marsanich K, Petarca L, Cozzani V (2005) Thermal degradation and decomposition products of electronic boards containing BFRs. Ind Eng Chem Res 44:4186–4199

    Article  CAS  Google Scholar 

  • Blazsó M, Zs C, Cs C (2002) Pyrolysis and debromination of flame retarded polymers of electronic scrap studied by analytical pyrolysis. J Anal Appl Pyrolysis 64:249–261

    Article  Google Scholar 

  • Byers TJ (1991) Printed circuit board design with microcomputer. McGraw-Hill, New York, USA

    Google Scholar 

  • Chen KS, Yeh RZ (1996) Pyrolysis kinetics of epoxy resin in a nitrogen atmosphere. J Hazard Mater 49:105–113

    Article  CAS  Google Scholar 

  • Chen KS, Yeh RZ, Wu CH (1997) Kinetics of thermal decomposition of epoxy resin in nitrogen-oxygen atmosphere. J Environ Eng-ASCE 123:1041–1046

    Article  CAS  Google Scholar 

  • Chen KS, Chen HC, Wu CH, Chou YM (1999) Kinetics of thermal and oxidative decomposition of printed circuit boards. J Environ Eng-ASCE 125:277–283

    Article  CAS  Google Scholar 

  • Chien YC, Wang HP, Lin KS, Huang YJ, Yang YW (2000) Fate of bromine in pyrolysis of printed circuit board wastes. Chemosphere 40:383–387

    Article  CAS  Google Scholar 

  • Clean Japan Center (2002) Tokyo, Japan: Recycling-Oriented Society.

  • Friedman HL (1964) Kinetics of thermal degradation of char-forming plastics from thermogravimetry: application to a phenolic plastics. J of Polym Sci Ser C 6:183–195

    Google Scholar 

  • Grabda M, Oleszek-Kudlak S, Rzyman M, Shibata E, Nakamura T (2009) Studies on bromination and evaporation of zinc oxide during thermal treatment with TBBPA. Environ Sci Technol 43:1205–1210

    Article  CAS  Google Scholar 

  • Grause G, Furusawa M, Okuwaki A, Yoshioka T (2008) Pyrolysis of tetrabromobisphenol-A containing paper laminated printed circuit boards. Chemosphere 71:872–878

    Article  CAS  Google Scholar 

  • Hall WJ, Williams PT (2007) Processing waste printed circuit boards for material recovery. Circuit World 33:43–50

    Article  CAS  Google Scholar 

  • Hornung A, Donner S, Balabanovich A, Seifert H (2005) Polypropylene as a reductive agent for dehalogenation for brominate organic compounds. J Clean Prod 13:525–530

    Article  Google Scholar 

  • Kang HY, Schoenung JM (2005) Electronic waste recycling: a review of U.S. infrastructure and technology options. Resour Conserv Recycl 45:368–400

    Article  Google Scholar 

  • Lassen C, Lokke S (1999) Brominated flame retardants substance flow analysis and assessment of alternatives. Danish Environmental Protection Agency, Copenhagen, Denmark

    Google Scholar 

  • Lee SM (1989) Dictionary of composite materials technology. Technomic Publishing Company Inc., Pennsylvanias, USA

    Google Scholar 

  • Lee CH, Chang SL, Wang KM, Wen LC (2000) Management of scrap computer recycling in Taiwan. J Hazard Mater A 73:209–220

    Article  CAS  Google Scholar 

  • Lee CH, Chang CT, Fan KS, Chang TC (2004) An overview of recycling and treatment of scrap computers. J Hazard Mater B 114:93–100

    Article  CAS  Google Scholar 

  • Lee JC, Song HT, Yoo JM (2007) Present status of the recycling of waste electrical and electronic equipment in Korea. Resour Conserv Recycl 50:380–397

    Article  Google Scholar 

  • Luda MP, Balabanovich AI, Camino G (2002) Thermal decomposition of the retardant brominated epoxy resins. J Anal Appl Pyrolysis 65:25–40

    Article  CAS  Google Scholar 

  • March J (1992) Advanced organic chemistry: reactions, mechanisms, and structure, 4th edn. John Wiley & Sons, New York

    Google Scholar 

  • Marsanich K, Zanelli S, Barontini F, Cozzani V (2004) Evaporation and thermal degradation of tetrabromobisphenol A above the melting point. Thermochim Acta 421:95–103

    Article  CAS  Google Scholar 

  • National Safety Council (1999) Electronic product recovery and recycle baseline report. Washington, DC, USA

  • Richter H, Lorenz W, Bahadir M (1997) Examination of organic and inorganic xenobiotics in equipped printed circuits. Chemosphere 35:169–179

    Article  CAS  Google Scholar 

  • Tohka A, Lehto H (2005) Mechanical and thermal recycling of waste from electric and electrical equipment. Helsinki University of Technology, Espoo, Finland

    Google Scholar 

  • United State Environmental Protection Agency (U.S. EPA) (1997) Measurement of Gaseous Organic Compound Emission by Gas Chromatography-Method 18; Code of Federal Regulation, Part 60. Subpart TTT; Government Printing Office, Washington, DC, USA

    Google Scholar 

  • U.S. EPA (2008) Partnership to evaluate flame retardants in printed circuit boards. Cincinnati, Ohio

    Google Scholar 

  • Vasile C, Brebu MA, Karayildrim T, Tanik J, Darie H (2007) Feedstock recycling from plastics and thermosets fractions of used computers. II. Pyrolysis oil upgrading. Fuel 86:477–485

    Article  CAS  Google Scholar 

  • Viet HM, Bernardes AM, Ferreira JZ, Tenório JAS, Malfatti CF (2006) Recovery of copper from printed circuit boards by mechanical processing and electrometallurgy. J Hazard Mater B137:1704–1709

    Article  Google Scholar 

  • Wang CF, Chin CJ, Luo SK, Men LC (1999) Determination of chromium in airborne particulate matter by high resolution and laser ablation inductively coupled plasma mass spectrometry. Anal Chim Acta 39:257–266

    Article  CAS  Google Scholar 

  • Yan FL (1998) Metals recovery from scrap IC board. Energy Resource Laboratory.

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Hung-Lung Chiang.

Additional information

Responsible editor: Alvin Lee Young

Electronic supplementary materials

Below is the link to the electronic supplementary material.

ESM1

(DOC 27 kb)

Rights and permissions

Reprints and permissions

About this article

Cite this article

Chiang, HL., Lo, CC. & Ma, SY. Characteristics of exhaust gas, liquid products, and residues of printed circuit boards using the pyrolysis process. Environ Sci Pollut Res 17, 624–633 (2010). https://doi.org/10.1007/s11356-009-0245-y

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11356-009-0245-y

Keywords

Navigation