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Stress evolution on gel-to-ceramic thin film conversion

  • Nanomaterials and Thin Films
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Abstract

In situ cracking observation, uncracking critical thickness evaluation and in situ stress measurement were conducted during heating for alkoxide-derived gel coating films. Higher water-to-alkoxide ratios and lower heating rates were shown to cause cracking at lower temperatures. The in situ stress measurement suggested that higher water-to-alkoxide ratios in solutions and lower heating rates result in larger in-plane tensile stress to be generated in the heating-up stage, which was thought to cause the cracking at lower temperatures. Methyltriethoxysilane, chelating agents and polyvinylpyrrolidone were shown to be effective in increasing uncracking critical thickness and/or thick film formation. The in situ stress measurement suggested that these additives or components are effective in suppressing the stress evolution during heating.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, Kansai University, 3-3-35 Yamate-cho, Suita, 564-8680, Japan

    Hiromitsu Kozuka

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  1. Hiromitsu Kozuka
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Correspondence to Hiromitsu Kozuka.

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Kozuka, H. Stress evolution on gel-to-ceramic thin film conversion. J Sol-Gel Sci Technol 40, 287–297 (2006). https://doi.org/10.1007/s10971-006-9213-x

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  • DOI: https://doi.org/10.1007/s10971-006-9213-x

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