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Microstructure evolution and electrical property improvement of Mn-based thin film thermistors with the sandwich structure

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Abstract

Mn1.85Co0.3Cu0.3Ni0.55O4 (MCCN), Mn1.85Co0.3Ni0.85O4 (MCN) thin film and MCN–MCCN–MCN sandwich structural thermistors were prepared on Pt/TiO2/Ti/SiO2/Si substrates by sol–gel technique. The crystalline structure, surface and cross-sectional morphologies of the prepared thermistors were analyzed by XRD and FESEM, respectively. The electric properties, such as the resistivity-temperature behaviors, sensitivity, stability, and dielectric constant, were investigated in detail. Compared with the MCCN and MCN thin film thermistors, the MCN–MCCN–MCN sandwich structural thermistor showed good microstructure, low resistivity, high sensitivity, small aging coefficient and moderate dielectric constant. The results showed that the multi-layer structure was an effective way to improve and adjust the properties of NTC thin film thermistors.

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Acknowledgments

This work were financially supported by the National key foundation for exploring scientific instrument (2012YQ14000511) and National Undergraduate Training Programs for Innovation and Entrepreneurship (201411819006 and 201411819007).

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Authors and Affiliations

  1. School of Electronic Engineering, Dongguan University of Technology, Dongguan, 523808, China

    L. He, M. Y. Wu, G. Zhang, D. X. Ling, M. X. Liu & L. Yang

  2. Department of Electronic Materials Science and Engineering, College of Materials Science and Engineering, South China University of Technology, Guangzhou, 510640, China

    Z. Y. Ling

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  1. L. He
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  2. Z. Y. Ling
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  3. M. Y. Wu
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  4. G. Zhang
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Correspondence to L. He.

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He, L., Ling, Z.Y., Wu, M.Y. et al. Microstructure evolution and electrical property improvement of Mn-based thin film thermistors with the sandwich structure. J Mater Sci: Mater Electron 26, 6314–6318 (2015). https://doi.org/10.1007/s10854-015-3218-6

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  • DOI: https://doi.org/10.1007/s10854-015-3218-6

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