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Method for contact resistance determination of copper during fast temperature changes

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Abstract

Contact resistance is crucial for temperature evolution at the fusion zone during resistance welding. In this paper, we introduce a new approach to determinate specific electrical contact resistance \({\rho }_{cont,el}\) for a constant contact pressure during dynamic temperature changes. We utilize total resistance curves from a specially designed experimental apparatus, implement them in a FEA-method and use this simulation method to separate material and contact resistance to calculate the specific contact resistance. The experimental setup is especially designed to achieve homogenous contact conditions during dynamic heating from real welding currents. We perform numerical and experimental validation of the developed determination method, including the usage of temperature measurements in the region of the fusion zone. Finally, we present pressure- and temperature-dependent data for specific contact resistance of Cu-ETP R200 (CW004A, soft) up to temperatures of 400 °C for two given contact pressures (64 MPa and 160 MPa) and a variation of contact surface properties. The data show a decrease in contact resistance with increasing temperature and pressure. Additionally, the properties of the surface show a strong influence on the contact resistance values.

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Funding

This research did not receive any specific grant from funding agencies in the public, commercial, or not-for-profit sectors.

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Authors and Affiliations

  1. Chair Materials for Electrical Engineering and Electronics, Institute of Materials Science and Engineering, Institute of Micro and Nanotechnology, MacroNano®, TU Ilmenau, Gustav-Kirchhoff-Str. 5, 98693, Ilmenau, Germany

    Lukas Biele & Peter Schaaf

  2. Corporate Sector Research and Advance Engineering, Robert Bosch GmbH, Post Box 30 02 40, 70442, Stuttgart, Germany

    Lukas Biele & Florian Schmid

Authors
  1. Lukas Biele
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  2. Peter Schaaf
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  3. Florian Schmid
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Contributions

BL: Conceptualization; Methodology; Investigation; Formal analysis; Validation; Visualization; Writing—original draft; editing and discussion. SF: Conceptualization; Writing—review and editing. SP: Conceptualization; Writing—review and editing.

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Correspondence to Lukas Biele.

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Handling Editor: Kevin Jones.

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Biele, L., Schaaf, P. & Schmid, F. Method for contact resistance determination of copper during fast temperature changes. J Mater Sci 56, 3827–3845 (2021). https://doi.org/10.1007/s10853-020-05490-w

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  • DOI: https://doi.org/10.1007/s10853-020-05490-w

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