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Solid state spreading in the Cu/Cu system

  • Proceedings of the IV International Conference High Temperature Capillarity
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Abstract

Solid state spreading of copper particles on a copper polycrystalline substrate was analysed at 1050∘C. A specific procedure was settled to produce pure monocrystalline and nearly spherical copper particles. Spreading dynamics were analysed from SEM images and preferential particle/substrate orientations were identified by EBSD. The effect of a preferential orientation on the spreading kinetics is limited, if any. A general agreement is found between the kinetic results and numerical calculations of Mullins [1] for mass transport by surface diffusion under the action of surface curvature gradients. The experimental kinetics are however significantly more rapid, due to the contribution of other mechanisms like volume diffusion.

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References

  1. F. A. NICHOLS and W. W. MULLINS, J. Appl. Phys. 36(6) (1965) 1826.

    Article  ADS  Google Scholar 

  2. A. M. POPA and J. M. CHAIX, Sci. Sinter. 2000 (2000) 97 (Special Issue).

    Google Scholar 

  3. R. M. PILLIAR and J. NUTTING, Philosoph. Mag. 16 (1967) 181.

    Article  CAS  ADS  Google Scholar 

  4. L. E. MURR, Mater. Sci. Eng. A-Struct. Mater. 12 (1973) 277.

    CAS  Google Scholar 

  5. J. C. HEYRAUD and J. J. METOIS, Acta Metall. 28 (1980) 1784.

    Google Scholar 

  6. U. GANGOPADHYAY and P. WYNBLATT, Metallurg. Mater. Trans. A (Phys. Metall. Mater. Sci.) 25a(3) (1994) 607.

    Article  CAS  ADS  Google Scholar 

  7. A. SOPER, B. GILLES and N. EUSTATHOPOULOS, Mater. Sci. Forum 207–209 (1996) 433.

    Article  Google Scholar 

  8. W. LOJKOWSKI, Progr. Mater. Sci. 45 (2000) 339.

    Article  Google Scholar 

  9. P. WYNBLATT, Acta Mater. 48(18–19) (2000) 4439.

    Article  CAS  Google Scholar 

  10. G. C. KUCZYNSKI, Trans. AIME 185 (1949) 169.

    Google Scholar 

  11. N. EUSTATHOPOULOS, M. NICHOLAS and B. DREVET “Wettability at High Temperatures” (Elsevier, Oxford, 1999).

    Google Scholar 

  12. O. DEZELLUS and N. EUSTATHOPOULOS, Scripta Mater. 40(11) (1999) 1283.

    Article  CAS  Google Scholar 

  13. T. YOSHUI, S. HARA and T. TANAKA Trans. J. W. R. I. 30 (Special Issue) (2001) 201.

    Google Scholar 

  14. W. LOJKOWSKI, H. GLEITER and R. MAURER, Acta Metall. 36(1) (1988) 69.

    Article  CAS  Google Scholar 

Download references

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Authors and Affiliations

  1. Laboratoire de Thermodynamique et de Physico-Chimie Métallurgiques (LTPCM), UMR 5614 CNRS-INPG/UJF, Domaine Universitaire, BP 75 38402, Saint-Martin D’Heres

    J. M. Missiaen, R. Voytovych, B. Gilles & N. Eustathopoulos

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  1. J. M. Missiaen
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  2. R. Voytovych
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  3. B. Gilles
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  4. N. Eustathopoulos
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Correspondence to J. M. Missiaen.

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Missiaen, J.M., Voytovych, R., Gilles, B. et al. Solid state spreading in the Cu/Cu system. J Mater Sci 40, 2377–2381 (2005). https://doi.org/10.1007/s10853-005-1962-3

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  • DOI: https://doi.org/10.1007/s10853-005-1962-3

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