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Essential and Non-essential Work of Fracture of PI/SiO2 Hybrid Thin Films

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Abstract

Essential work of fracture (EWF) analysis is used to study the effect of the silica doping level on fracture toughness of polyimide/silica (PI/SiO2) hybrid films. By using double-edge-notched-tension (DENT) specimens with different ligament lengths, it seems that the introduction of silica additive can improve the specific essential work of fracture (w e ) of PI thin films, but the specific non-essential work of fracture (βw p ) will decease significantly as the silica doping level increasing from 1 to 5 wt.%, and even lower than that of neat PI. The failure process of the fracture is investigated with online scanning electron microscope (SEM) observation and the parameters of non-essential work of fracture, β and w p , are calculated based on finite element (FE) method.

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Acknowledgements

This work was funded by Natural Science Foundation of China (No 10502005).

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Authors and Affiliations

  1. Institute of Engineering Mechanics, Beijing JiaoTong University, Beijing, 100044, China

    Z. D. Wang & J. J. Lu

  2. Institute of Mechanics, Chinese Academy of Sciences, Beijing, 100080, China

    Z. D. Wang

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  1. Z. D. Wang
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  2. J. J. Lu
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Correspondence to Z. D. Wang.

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Wang, Z.D., Lu, J.J. Essential and Non-essential Work of Fracture of PI/SiO2 Hybrid Thin Films. Appl Compos Mater 14, 33–45 (2007). https://doi.org/10.1007/s10443-006-9029-4

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  • DOI: https://doi.org/10.1007/s10443-006-9029-4

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