Abstract
Ni-Cu/Cu multilayers and Ni x Cu1−x alloy films were electrodeposited on Au-coated glass substrates from a sulfamate-based electrolyte. The room-temperature magnetoresistance of the multilayers was studied as a function of the ferromagnetic Ni-Cu layer thickness. Giant magnetoresistance was observed, which peaked at about 1% for a Ni-Cu layer thickness around 15 Å. Magnetoresistance measurements of Ni x Cu1−x films of different composition were obtained at both room temperature and 77 K. Anisotropic magnetoresistance of up to 1.1% and 1.7% was observed at room temperature and 77 K, respectively.
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Kazeminezhad, I., Schwarzacher, W. Giant magnetoresistance in electrodeposited Ni-Cu/Cu multilayers and anisotropic magnetoresistance in pulse-plated Ni x Cu1−x alloy films. J Solid State Electrochem 8, 187–189 (2004). https://doi.org/10.1007/s10008-003-0422-8
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DOI: https://doi.org/10.1007/s10008-003-0422-8