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Recent developments in dimensional metrology for microsystem components

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Abstract

 The PTB currently develops a special coordinate measuring machine (μCMM) for three-dimensional metrology on microsystem components. This μCMM is aimed at a measurement uncertainty of 3D-coordinates of <0.1 μm for microstructures. The instrument contains an opto-tactile sensor and a new tactile 3D-micro-sensing system. The 3D-micro probe is based on a silicon boss-membrane with piezo resistive transducers which allow measuring deflections of the probe pin and simultaneously forces in three dimensions. First 2D-probing experiments with a stiff commercial stylus, 15 mm long, with a 300 μm ruby ball have been carried out showing its resolution and repeatability.

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Received: 30 May 2001/Accepted: 15 October 2001

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Cao, S., Brand, U., Kleine-Besten, T. et al. Recent developments in dimensional metrology for microsystem components. Microsystem Technologies 8, 3–6 (2002). https://doi.org/10.1007/s00542-001-0156-4

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  • DOI: https://doi.org/10.1007/s00542-001-0156-4

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