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Study of the dynamic wetting behavior of Sn droplet impacting Cu substrate

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Abstract

The spreading and wetting behavior of metal droplets impacting substrate surface has an important influence on the quality of jet forming, additive manufacturing, and other products. Nonetheless, due to the high speed and complexity of the impact process, there are few studies on the impact behavior of metal droplet impacting metal substrate. In this paper, the dynamic wetting behavior of Sn droplet impinging on Cu substrate is studied by simulation and experiment. Numerical simulation uses CLSVOF method to establish a single droplet of tin impact on cold copper substrate (temperature below 230 ℃) model. The effects of substrate temperature (50–200 ℃), droplet impact velocity (1–6 m/s) and substrate average roughness (0.05 μm, 0.1 μm, 0.5 μm, 1 μm, and smooth surface) on droplet spreading behavior were investigated. The spreading and wetting behavior of the single droplet liquid impinging on a cold copper substrate was studied by a high-speed camera. The results show that the substrate temperature has a great influence on the droplet spreading process and the final spreading factor but has little influence on the final contact angle. The droplet impact velocity has a great influence on the droplet spreading process, the final spreading factor, and the final contact angle. The average surface roughness of the substrate has little effect on the whole spreading process, but the final contact angle decreases first and then increases with the increase of surface roughness. The results reflect the morphology change of the droplet spreading solidification process, and explain the dynamic wetting state of the droplet spreading more directly.

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Acknowledgements

The authors gratefully acknowledge the financial support provided by National Natural Science Foundation of China (Grant No. 51465032 and No.52061023).

Funding

Natural Science Foundation Project of Chongqing, Chongqing Science and Technology Commission, 51465032, Innovative Research Group Project of the National Natural Science Foundation of China, 52061023.

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Authors and Affiliations

  1. State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou, 730050, Gansu, China

    Weiyuan Yu, Mingkang Wang, Fengfeng Wang, Xiwushan Wang & Baolei Wu

  2. School of Materials Science and Engineering, Lanzhou University of Technology, Lanzhou, 730050, Gansu, China

    Weiyuan Yu, Mingkang Wang, Fengfeng Wang, Xiwushan Wang & Baolei Wu

  3. Institute of Modem Physics, Chinese Academy of Sciences, Nanchang Rd., Lanzhou, 730000, Gansu, China

    Fengfeng Wang

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  1. Weiyuan Yu
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  2. Mingkang Wang
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  3. Fengfeng Wang
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  4. Xiwushan Wang
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Correspondence to Weiyuan Yu.

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Yu, W., Wang, M., Wang, F. et al. Study of the dynamic wetting behavior of Sn droplet impacting Cu substrate. Appl. Phys. A 128, 646 (2022). https://doi.org/10.1007/s00339-022-05795-4

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