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Material removal profile for large mould polishing with coated abrasives

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Abstract

This paper analytically develops a type of model for predicting material removal depth in large mould polishing with coated abrasives. This model based on the statistical theory, and the abrasive material surface contact mechanics is established. The material removal depth is calculated by integrating the linear removal intensity or the removal depth per unit time along the polishing path. The material removal depth profiles of the circular abrasive tool and the annular abrasive tool are presented when polishing paths are a straight line and a curve, respectively. The effects of process parameters on the material removal depth are simulated and analyzed, such as polishing pressure, feed rate, tool speed, and internal radius, when the polishing path is a straight line. The workpiece surfaces after milling were polished by using annular abrasive tool moving along a straight line in the experiment. This model is evaluated by comparing the theoretical material removal depth with those experimental results available. It is concluded that the experiment results are approximately consistent with the model predictions.

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References

  1. Yang Z, Chen F, Zhao J, Wu X (2009) A novel vision localization method of automated micro-polishing robot. J Bionic Eng 6(1):46–54

    Article  Google Scholar 

  2. Tsai M, Huang J, Kao W (2009) Robotic polishing of precision molds with uniform material removal control. Int J Mach Tools Manuf 49:885–895

    Article  Google Scholar 

  3. Guo HR, Wu YB, Lu D, Fujimoto M, Nomura M (2014) Effects of pressure and shear stress on material removal rate in ultra-fine polishing of optical glass with magnetic compound fluid slurry. J Mater Process Technol 214(11):2759–2769

    Article  Google Scholar 

  4. Dong ZC, Cheng HB (2014) Study on removal mechanism and removal characters for SiC and fused silica by fixed abrasive diamond pellets. Int J Mach Tools Manuf 85:1–13

    Article  Google Scholar 

  5. Guo J, Suzuki H, Higuchi T (2013) Development of micro polishing system using a magnetostrictive vibrating polisher. Precis Eng 37:81–87

    Article  Google Scholar 

  6. Liu XY, Liu YL, Liang Y, Zhao ZW, Gao BH (2012) Kinetics model incorporating both the chemical and mechanical effects on material removal for copper chemical mechanical polishing. Microelectron Eng 91:19–23

    Article  Google Scholar 

  7. Lin ZC, Huang WS, Tsai JS (2012) A study of material removal amount of sapphire wafer in application of chemical mechanical polishing with different polishing pads. J Mech Sci Technol 26(8):2353–2364

    Article  Google Scholar 

  8. Cheung CF, Kong LB, Ho LT, To S (2011) Modeling and simulation of structure surface generation using computer controlled ultra-precision polishing. Precis Eng 35:574–590

    Article  Google Scholar 

  9. Kim S, Saka N, Chun JH (2014) The effect of pad-asperity curvature on material removal rate in chemical-mechanical polishing. Procedia CIRP 14:42–47

    Article  Google Scholar 

  10. Lin ZC, Wang RY (2014) Abrasive removal depth for polishing a sapphire wafer by a cross-patterned polishing pad with different abrasive particle sizes. Int J Adv Manuf Technol 74(1–4):25–36

    Article  Google Scholar 

  11. Lee HS, Jeong HD, Dornfeld DA (2013) Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes. Precis Eng 37:483–490

    Article  Google Scholar 

  12. Jin XL, Zhang LC (2012) A statistical model for material removal prediction in polishing. Wear 274–275:203–211

    Article  Google Scholar 

  13. Chen XC, Zhao YW, Wang YG (2012) Modeling the effects of particle deformation in chemical mechanical polishing. Appl Surf Sci 258(22):8469–8474

    Article  Google Scholar 

  14. Wang GL, Wang YQ, Xu ZX (2009) Modeling and analysis of the material removal depth for stone polishing. J Mater Process Technol 209:2453–2463

    Article  Google Scholar 

  15. Lin TR (2007) An analytical model of the material removal rate between elastic and elastic-plastic deformation for a polishing process. Int J Adv Manuf Technol 32(7–8):675–681

    Article  Google Scholar 

  16. Fan C, Zhao J, Zhang L, Wong YS, Hong GS, Zhou WS (2014) Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad. J Mater Process Technol 214:285–294

    Article  Google Scholar 

  17. Feng DY, Sun YW, Du HP (2014) Investigations on the automatic precision polishing of curved surfaces using a five-axis machining centre. Int J Adv Manuf Technol 72(9–12):1625–1637

    Article  Google Scholar 

  18. Chen Y, Nguyen T, Zhang LC (2009) Polishing of polycrystalline diamond by the technique of dynamic friction—Part 5: quantitative analysis of material removal. Int J Mach Tools Manuf 49:515–520

    Article  Google Scholar 

  19. Zeng SY, Blunt L (2014) Experimental investigation and analytical modelling of the effects of process parameters on material removal rate for bonnet polishing of cobalt chrome alloy. Precis Eng 38:348–355

    Article  Google Scholar 

  20. Zeng S, Blunt L (2014) An experimental study on the correlation of polishing force and material removal for bonnet polishing of cobalt chrome alloy. Int J Adv Manuf Technol 73(1–4):185–193

    Article  Google Scholar 

  21. Pan GS, Wang N, Gong H, Liu Y (2012) An empirical approach to explain the material removal rate for copper chemical mechanical polishing. Tribol Int 47:142–144

    Article  Google Scholar 

  22. Klocke F, Zunke R (2009) Removal mechanisms in polishing of silicon based advanced ceramics. CIRP Annals-Manufacturing Technology 58:491–494

    Article  Google Scholar 

  23. Atkins AG, Liu JH (2007) Toughness and the transition between cutting and rubbing in abrasive contacts. Wear 262:146–159

    Article  Google Scholar 

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Authors and Affiliations

  1. College of Mechanical Engineering, Jiamusi University, Jiamusi, 154007, China

    Guilian Wang, Haibo Zhou & Guangjun Chen

  2. College of Mechanical Engineering, Jilin University, Changchun, 130025, China

    Xiaoqin Zhou & Xu Yang

Authors
  1. Guilian Wang
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  2. Xiaoqin Zhou
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  3. Xu Yang
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  4. Haibo Zhou
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  5. Guangjun Chen
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Correspondence to Guilian Wang.

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Wang, G., Zhou, X., Yang, X. et al. Material removal profile for large mould polishing with coated abrasives. Int J Adv Manuf Technol 80, 625–635 (2015). https://doi.org/10.1007/s00170-014-6378-2

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  • DOI: https://doi.org/10.1007/s00170-014-6378-2

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