Abstract
In this study, the authors applied the low-temperature ultrasonic soldering method to solder aluminum alloy honeycomb structure and investigated the effects of soldering time and soldering temperature on the properties of the solder. The following results were obtained: The wetting angle changed with applied time and applied temperature. The solder region is mainly composed of four kinds of microstructure zones: rich Sn zone, rich Pb zone, Sn–Pb eutectic phase, and rich Al zone. Microanalysis identified a continuous reaction product at the alumina–solder interface as a rich Pb zone. The wet angle data had significantly greater variability, with values ranging from 10° to 90°. The highest value was obtained for the samples soldered with Sn–Pb–Zn alloy for 30 s. Fractures occurred along the solder–alumina interface for the 6061 aluminum alloy. Fracture surface included hybrid tough fracture of dimple and tear ridge. The interface could firstly strip at the rich Bi zone with the effect of shear stress.
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Yi-Ming Jen, Chih-Wei Ko, Hong-Bin Lin (2009) Effect of the amount of adhesive on the bending fatigue strength of adhesively bonded aluminum honeycomb sandwich beams. Int J Fatigue 31:455–462
Shafizadeh JE, Seferis JC (1999) High temperature thermal analysis characterization of honeycomb core. Polym Eng Sci 4:733–740
Kim BJ, Lee DG (2008) Characteristics of joining inserts for composite sandwich panels. Compos Struct 86:55–60
Nakanishi H, Nanba K, Sano H, Ito Y. Brazed aluminium honeycomb panels—mechanical strengths and weldability. Sumitomo Keikinzoku Giho/Sumitomo Light Metal Technical Reports 1988:52–59
Okuto K, Namba K, Mizukoshi H, Hiyama Y. Analysis and design of honeycomb welded structures. Keikinzoku Yosetsu/Journal of Light Metal Welding and Construction 1991: 361–368
Lamb RA. Aluminum soldering and brazing application. ASM Proceedings: Heat Treating, 1998, 283–285
Mehrham PA, Diberadino MF, Donnellan TM (1991) Low temperature cure adhesive for honeycomb repair applications. Int SAMPE Tech Conf Ser 23:1072–1082
Weis S, Hoyer I, Wielage B (2008) Joining of high-strength aluminum-based materials with tin-based solders. Weld J 3:35–37
Wielage B, Hoyer I, Weis S (2007) Soldering aluminum matrix composites. Weld J 3:67–70
Lakshminarayanan AK, Balasubramanian V, Elangovan K (2009) Effect of welding processes on tensile properties of AA6061 aluminum alloy joints. Int J Adv Manuf Technol 40:2086–2296
Hosking, F.M. Fluxless soldering as an environmentally compatible manufacturing alternative. Manufact 1992:53–64
Hui IK, Ipyn WLR (2000) Wetting analysis of leadless chips in surface mount technology. Int J Adv Manuf Technol 16:675–680
Liu Y, Liang D (2005) A contribution to the Al–Pb–Zn ternary system. J Alloy Compd 403:116
Islam RA, Chan YC, Jillek W, Islam S (2006) Comparative study of wetting behavior and mechanical properties (microhardness) of Sn–Zn and Sn–Pb solders. Microelectron J 37:705–713
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Min, D., Pei-lei, Z., Zhen-yu, Z. et al. A novel assembly technology of aluminum alloy honeycomb structure. Int J Adv Manuf Technol 46, 1253–1258 (2010). https://doi.org/10.1007/s00170-009-2173-x
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DOI: https://doi.org/10.1007/s00170-009-2173-x