Optimisation of the Substrate Preheat Temperature for the Encapsulation of Flip Chip Devices

This research addressed the feasibility of using a substrate preheat temperature which is higher than the manufacturer’s recommendation in order to reduce the cycle time of the encapsulation process while still ensuring package reliability. temperature are discussed and evaluated. A statistical model was generated to help determine the optimal substrate preheat temperature for given chip dimensions, standoff height, surface texture, etc. Using the substrate preheat temperature determined by the model, the flow time of the encapsulant could be reduced by more than a factor of two while still ensuring a 6s quality level.