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Electrodeposition of copper on copper single crystal (100), (110) and (111) planes in presence of Thiosemicarbazide

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Abstract

Thiosemicarbazide (TSC), present in small quantities in acid copper sulphate bath, modifies the growth habits of copper on copper single crystal planes and reduces cathodic polarization. On (100) plane a transition from layer type of growth to ridge type and from ridges to pyramidal type and finally to polycrystalline type was noticed. On (110) plane ridges change to platelet type then finally to polycrystalline type. On (111) plane at low current densities triangular pyramids formed in pure solution transforms to hexagonal pyramids and to polycrystalline type. At high current densities hexagonal pyramids change to layer type, which transforms to nonsymmetrical pyramids and polycrystalline deposit at critical concentration of the addition agent. The transitions noticed depend on the concentrations of TSC and current density. These changes in morphology are attributed to the adsorption of TSC on the substrate.

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Authors and Affiliations

  1. Department of Chemistry, Central College, Bangalore University, Bangalore-1

    B. S. Sheshadri & T. H. V. Setty

Authors
  1. B. S. Sheshadri
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  2. T. H. V. Setty
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Communicated by Prof. M. Santappa,f.a.sc.

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Sheshadri, B.S., Setty, T.H.V. Electrodeposition of copper on copper single crystal (100), (110) and (111) planes in presence of Thiosemicarbazide. Proc. Indian Acad. Sci. 76, 167–175 (1972). https://doi.org/10.1007/BF03048345

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  • DOI: https://doi.org/10.1007/BF03048345

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