Abstract
Ohmic contacts to high resistivity indium antimonide have been made by displacement plating of copper. Some relevant facts regarding the plating process are presented.
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Kunze, O.A., Neely, J.A. & Tuma, W. Non-rectifying contacts to indium antimonide by immersion plating. J. Electron. Mater. 6, 425–430 (1977). https://doi.org/10.1007/BF02660496
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DOI: https://doi.org/10.1007/BF02660496