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Investigation of the fracture mechanism of Ti-5AI-2.5Sn at cryogenic temperatures

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Abstract

Fractography and metallographic sectioning were used to investigate the influence of microstructure on the fracture mechanism and fracture toughness (KIc) of normal interstitial and extra low interstitial (ELI) Ti-5Al-2.5Sn at 20 K (-423°F) and 77 K (-320°F). Plates of each grade were mill annealed at 815°C (1500°F) followed by either air or furnace cooling. These variations in composition and cooling rate resulted in differences in the volume fraction and internal structure of the dispersed β phase and in the ordering of the α matrix. The ELI alloys were tougher than the normal interstitial plates. KIc of the furnace-cooled ELI plate was 25 pct lower than that of the air-cooled ELI material. Variations in cooling rate had no influence of KIc of the normal interstitial alloys. Fractography showed that a large portion of the fracture surfaces were covered with elongated dimples commonly called “flutes.” Metallographic sections of specimens deformed at 77 K showed that these features form at the intersections of slip bands or deformation twins with grain or twin boundaries. Ordering and higher interstitial levels increase the local strain in slip bands resulting in void nucleation at lower macroscopic strains and lower KIc values.

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Authors and Affiliations

  1. General Electric Research and Development Center, 12301, Schenectady, NY

    R. H. Van Stone

  2. Carnegie-Mellon University, 15213, Pittsburgh, PA

    J. R. Low (Professor Emeritus of Metallurgy and Materials Science)

  3. Strength of Materials Section, NASA-Lewis Research Center, 44135, Cleveland, OH

    J. L. Shannon (Head)

Authors
  1. R. H. Van Stone
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  2. J. R. Low
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  3. J. L. Shannon
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Additional information

Formerly Graduate Student, Department of Metallurgy and Materials Science, Carnegie-Mellon University, Pittsburgh, PA.

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Van Stone, R.H., Low, J.R. & Shannon, J.L. Investigation of the fracture mechanism of Ti-5AI-2.5Sn at cryogenic temperatures. Metall Trans A 9, 539–552 (1978). https://doi.org/10.1007/BF02646411

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  • DOI: https://doi.org/10.1007/BF02646411

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