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The effects of descaling treatments on intermetallic formation and thermomechanical stability of an electroplated tin/lead layer in a semiconductor leadframe alloy

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Journal of Materials Science Letters

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References

  1. T. b. massalski (editor), “Binary alloy phase diagrams”, 2nd Edn (American Society for Metals International, Metals Park, Ohio) p. 1482.

  2. K. N. Tu and R. D. Thomson, Acta Metall. 30 (1982) 947.

    Google Scholar 

  3. J. O. G. Parent, D. D. L. Chung and I. M. Bernstein, J. Mater. Sci. 23 (1988) 2564.

    Google Scholar 

  4. J. Hoyt, Brazing Soldering 13 (1987) 10.

    Google Scholar 

  5. D. S. Dunn, T. F. Marinis, W. M. Sherry and C. J. Williams, in “Electronic packaging materials science”, edited by E. A. Geiss, K. N. Tu and D. R. Uhlman (Materials Research Society, Pittsburgh, Pennsylvania, 1985) p. 129.

    Google Scholar 

  6. Q. Yiyu, F. Hongyuan, C. Dinghua, F. Fuhua and H. Lixia, Brazing Soldering 13 (1987) 39.

    Google Scholar 

  7. P. E. Davis, M. Z. Warwick and S. J. Muckett, Plating Surf. Finishing 70 (1983) 49.

    Google Scholar 

  8. L. Revay, Surf. Technol. 5 (1977) 57.

    Google Scholar 

  9. P. J. Kay and C. A. Mackay, Trans. Inst. Met. Finishing 54 (1976) 68.

    Google Scholar 

  10. E. Starke and H. Wever, Z. Metallkde 55 (1964) 107.

    Google Scholar 

  11. M. Onishi and H. Fujihuchi, Trans. Jpn. Inst. Met. 16 (1975) 539.

    Google Scholar 

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Authors and Affiliations

  1. Motorola Korea Ltd, 441 Kwangjang-Doug, 133-210, Sunydong-ku, Seoul, Republic of Korea

    T. Y. Chung

  2. Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1, Yusong-gu, Kusong-dong, Taejon, Republic of Korea

    T. J. Cho & Y. G. Kim

Authors
  1. T. Y. Chung
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  2. T. J. Cho
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  3. Y. G. Kim
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Chung, T.Y., Cho, T.J. & Kim, Y.G. The effects of descaling treatments on intermetallic formation and thermomechanical stability of an electroplated tin/lead layer in a semiconductor leadframe alloy. J Mater Sci Lett 13, 1465–1468 (1994). https://doi.org/10.1007/BF00419136

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  • DOI: https://doi.org/10.1007/BF00419136

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