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Creep in chipboard

Part 2: The use of fitted response curves for comparative and predictive purposes

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Summary

Previous linear and curvilinear regression models for predicting the creep deflection of timber and timber products have failed to provide an adequately good fit. However, this paper shows that the 4-element (and to a lesser degree the 3-element) rheological model provides an extremely good fit to chipboard creep data.

A set of experiments has been carried out on the creep behaviour of five commercially-available types of chipboard under 3-point sustained loading at constant temperature and humidity. This range of board types encompassed three types of glue — UF, MF/UF and Pf- and was loaded at two stress levels-30% and 60% of the short term ultimate stress. The lifetime of these specimens ranged from 25 days to over 31/2 years until either failure occurred or the load was removed.

Creep curves based on 3- and 4-element rheological models have been fitted to the data from each specimen using an iterative least squares computer program which we developed. The validity of the two models is discussed, together with studies on the comparative behaviour of different board types and the use of the models as predictive tools.

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Authors and Affiliations

  1. Department of the Environment, Building Research Establishment, Princes Risborough Laboratory, Aylesbury, UK

    C. B. Pierce, J. M. Dinwoodie & B. H. Paxton

Authors
  1. C. B. Pierce
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  2. J. M. Dinwoodie
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  3. B. H. Paxton
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Pierce, C.B., Dinwoodie, J.M. & Paxton, B.H. Creep in chipboard. Wood Sci. Technol. 13, 265–282 (1979). https://doi.org/10.1007/BF00356969

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  • DOI: https://doi.org/10.1007/BF00356969

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