Abstract
In this work, a comparative analysis is provided for technological indicators of various methods of technical levitation. Later, mathematical model was formed for particular cases of the gap of electromagnetic levitation and many composite non-contact mechanisms. This analysis mechanics creates effective contactless mechanisms which help us many aspects of energy and material saving.
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References
Vandalaele V, Lambert P, Delchambre A (2005) Non—contact handling in microassembly: acoustical levitation. Precision Eng 29(4):491–505
Isobe H, Fushimi M, Oosuka M, Kyusojn A (2007) Non-contact transportation of flat panel substrate by combined ultrasonic acoustic viscous and aerostatic forces. Int J Precision Eng Manu-f 8(2):44–48
Neyman LA, Neyman VY (2015) Matematicheskaya model’ elektromekhanicheskoy sistemy kolebatel’nogo dvizheniya s uprugimi svyazyami.« Vestnik IGEU » Vypusk 6
Matmurodov FM, Matmurodov FF (2018) Beskontaktnyye i dempfiruyushchiye mekhanizmy. Monografiya –T: « Fan va texnologiya, 184C
Urazayev V ( 2007) Tekhnicheskaya levitatsii—metody obzorov. Tekhnologii v elektronnoy promyshlennosti, vol 6
Sizov R (2015) Real magnetic charges in the substance, ferrogravitation and technical levitation. J Modern Phys 6:1591–1561
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© 2021 The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.
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Matmurodov, F.M., Sikarwar, B.S., Bhandwal, M. (2021). Investigation of Types of Technical Levitation and Mathematical Modeling of the Action of Many Composites Non-contact Electromechanical Mechanism. In: Joshi, P., Gupta, S.S., Shukla, A.K., Gautam, S.S. (eds) Advances in Engineering Design. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-33-4684-0_33
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DOI: https://doi.org/10.1007/978-981-33-4684-0_33
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