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Effects of Hybrid Nanofluids on the Thermal Performance of Heat Pipe: An Experimental Investigation

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Advances in Fluid and Thermal Engineering

Part of the book series: Lecture Notes in Mechanical Engineering ((LNME))

Abstract

A heat pipe is an excellent heat transfer device, widely used in electronics cooling. Nanofluids have superior thermophysical properties. Researchers noticed that nanofluids are very effective working fluids as they enhanced the heat transfer characteristics of heat pipes (HPs). Mono nanofluids have their limitations regarding the applications in heat pipes. Therefore, the research community extends its work toward the application of hybrid nanofluids. In the present investigation, the authors used TiO2/H2O and (TiO2 + MWCNT)/H2O as working fluid in the HP for a wide range of power input (50–100 watts). The authors noticed the significant enhancement in the performance of HP using hybrid nanofluids. The mechanisms/causes of enhancement in the TPHP have been identified.

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Abbreviations

HP:

Heat Pipe

CHF:

Critical heat flux

HTC:

Heat transfer coefficient

TEHP:

Thermal efficiency of heat pipe

TPHP:

Thermal performance of heat pipe

TRHP:

Thermal resistance of heat pipe.

References

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Author information

Authors and Affiliations

  1. Institute of Engineering and Technology, GLA University, Mathura, 281406, India

    Naveen Kumar Gupta

Authors
  1. Naveen Kumar Gupta
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Corresponding author

Correspondence to Naveen Kumar Gupta .

Editor information

Editors and Affiliations

  1. Amity University Uttar Pradesh, Noida, India

    Basant Singh Sikarwar

  2. Lund University, Lund, Sweden

    Bengt Sundén

  3. Xi'an Jiaotong University, Shaanxi, China

    Qiuwang Wang

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Gupta, N.K. (2021). Effects of Hybrid Nanofluids on the Thermal Performance of Heat Pipe: An Experimental Investigation. In: Sikarwar, B.S., Sundén, B., Wang, Q. (eds) Advances in Fluid and Thermal Engineering. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-16-0159-0_45

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  • DOI: https://doi.org/10.1007/978-981-16-0159-0_45

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-16-0158-3

  • Online ISBN: 978-981-16-0159-0

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