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Research on Creep Resistance of Flexible Pressure Sensor Based on Anhydride Curing Agent

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Applied Sciences in Graphic Communication and Packaging

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 477))

Abstract

In this article, the resistance value of the flexible pressure sensor was measured at the constant temperature and pressure, and combined with anhydride curing agent, a comparative experiment was carried out to investigate the effect of anhydride curing agent on the creep resistance of flexible pressure sensor. The result of experiment showed that the epoxy resin and the anhydride proceed the crosslinking reaction after the flexible pressure sensor was added to the anhydride curing agent. The network structure was formed, the volume of the polymer was reduced, the hardness was increased, and the resistance creep performance was increased. In addition, the result of creep test showed that the content of curing agent and curing temperature had a significant influence on the creep resistance of the sensor.

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Acknowledgements

This work is supported by the Million class brain chip project, the National Natural Science Foundation of China (61501039), the Beijing Research Grant (No. Z15110000915071), the support of Beijing Municipal Education Commission (No. SQKM201710015005), the Initial funding for the Doctoral Program of BIGC (27170116005/040), the Elite Program of BIGC (04190117004/010), the Collaborative Innovation Center 04190117029/002, the Discipline Construction 04190117013, the Discipline Construction of Printed Electronic Technology and Engineering Advantage 21090117001, and financial support for Innovative Teams of Printed Electronic Materials and Technologies.

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Correspondence to Wei Wang or Luhai Li .

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Xu, F. et al. (2018). Research on Creep Resistance of Flexible Pressure Sensor Based on Anhydride Curing Agent. In: Zhao, P., Ouyang, Y., Xu, M., Yang, L., Ren, Y. (eds) Applied Sciences in Graphic Communication and Packaging. Lecture Notes in Electrical Engineering, vol 477. Springer, Singapore. https://doi.org/10.1007/978-981-10-7629-9_112

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  • DOI: https://doi.org/10.1007/978-981-10-7629-9_112

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-10-7628-2

  • Online ISBN: 978-981-10-7629-9

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