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Thermal Study of a Laser Diode Using a Finite Element Method Associated with a Meshing Superimposition Method

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Thermal Management of Electronic Systems

Abstract

Temperature is an important parameter as regards the functioning of laser diodes. However, since the power is dissipated in a very small volume in comparison with the whole laser, digital simulations require a meshing which is complex and long to realize. For these reasons, a meshing superimposition method (MSM) was used to calculate the temperature of the laser diodes. This method is a variant of the finite-element method with make it possible to superimpose a coarse mesh (on the whole field), and a fine mesh in areas with drastic temperature profiles. The connection between the two meshes is made analytically which avoids connection problems regarding meshes of different sizes.

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Author information

Authors and Affiliations

  1. Laboratoire d’Informatique, Ecole Nationale Supérieure de Mécanique et d’Aérotechnique, 86034, Poitiers Cedex, France

    N. Ottavy & M. Bourhrara

  2. Centre National d’Etudes des Télécommunications, 22301, Lannion Cedex, France

    J. -P. Le Jannou & P. Paris

Authors
  1. N. Ottavy
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  2. M. Bourhrara
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  3. J. -P. Le Jannou
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  4. P. Paris
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Editor information

Editors and Affiliations

  1. J. M. Burgers Centre for Fluid Mechanics, Delft University of Technology, Delft, The Netherlands

    C. J. Hoogendoorn  & R. A. W. M. Henkes  & 

  2. Philips B.V., Eindhoven, The Netherlands

    C. J. M. Lasance

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© 1994 Springer Science+Business Media Dordrecht

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Ottavy, N., Bourhrara, M., Le Jannou, J.P., Paris, P. (1994). Thermal Study of a Laser Diode Using a Finite Element Method Associated with a Meshing Superimposition Method. In: Hoogendoorn, C.J., Henkes, R.A.W.M., Lasance, C.J.M. (eds) Thermal Management of Electronic Systems. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1082-2_11

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  • DOI: https://doi.org/10.1007/978-94-011-1082-2_11

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-4472-1

  • Online ISBN: 978-94-011-1082-2

  • eBook Packages: Springer Book Archive

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