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Capacitance of Transducers for Displacement Measurement

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Electrical Engineering Applications

Part of the book series: Topics in Boundary Element Research ((TBOU,volume 7))

Abstract

The calculation or measurement of capacitances is a basic problem to determine the form or performance of electrical, electronic devices and components such as VLSI [1–6], capacitive transducer [7–10] for an automatic and precise measurement of displacement, and lead cable [11]. Computer simulations have been applied to obtaining the performance or optimum form of VLSI [5, 6], of capacitive transducer [8–10], and of lead cable [11]. It is the most efficient and economical to become able to obtain the optimum form or performance of electrical, electronic devises and components only by a computer simulation without any actual experiment, but it becomes more efficient and economical only if the labours and costs of actual measurements are largely reduced by means of computer simulation.

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References

  1. Scheinfein, M.R., Liao, J.C., Palusinski, O.A., Prince, J.L.: Electrical performance of high-speed interconnect systems. IEEE Trans. on Components, Hybrids and Manufacturing Technology, vol. CHMT 10, 303–309 (1987).

    Article  Google Scholar 

  2. Dang, R.L.M., Shigyo, N.: Coupling capacitances for two-dimensional wires. IEEE Trans. on Electron Device Letters, vol. EDL 2, 196–197 (1981).

    Article  Google Scholar 

  3. Harter, J., Jacobs, H., Zwar, M., Skapa, H.: Quasi-two-dimensional simulation of transient latchup effect in VLSI CMOS circuit. IEEE Trans. on Electron Devices, vol. ED 32, 1665–1668 (1985).

    Article  Google Scholar 

  4. Chan, T.Y., Wu, A.T., Ko, P.K., Hu, C.: A capacitance method to determine the gate-to-drain/source overlap length of MOSFET’s. IEEE Trans. on Electron Device Letters, vol. EDL 8, 269–271 (1987).

    Article  Google Scholar 

  5. Kwon, O.K., Pease, R.F.W.: Closely packed microstrip lines as very high-speed chip-to-chip interconnects. IEEE Trans. on Components, Hybrids, and Manufacturing Technology, vol. CHMT 10, 314–320 (1987).

    Article  Google Scholar 

  6. Cottrell, P.E., Buturia, E.M.: VLSI wiring capacitance. IBM J. Res. Develop., vol. 29, 277–287 (1985).

    Google Scholar 

  7. Kosel, P.B., Munro, G.S., Vaughan, R.: Capacitive transducer for accurate displacement measurement, IEEE Trans. on Instrumentation and Measurement, vol. IM 30, 114–123 (1981).

    Google Scholar 

  8. Hirasawa, M., Nakamura, M., Kanno, M.: Optimum design of capacitive transducer for displacement measurement, Proc. Int. AMSE Symposium “Modelling and Simulation”, Bermuda, 131–135 (1983).

    Google Scholar 

  9. Hirasawa, M., Nakamura, M., Kanno, M.: Optimum form of capacitive transducer for displacement measurement, IEEE Trans. on Instrumentation and Measurement, vol. IM 33, 276–280 (1984).

    Article  Google Scholar 

  10. Hirasawa, M., Nakamura, M.: Analysis of capacitive transducer for displacement measurement by boundary element method, Proc. 8th Int. Conf. B. E. M, Tokyo 1986.

    Google Scholar 

  11. Olson, L.T.: Application of the finite element method to determine the electrical resistance, impedance, capacitance parameters for the circuit package environment, IEEE trans. on Components, Hybrids, and Manufacturing Technology, vol. CHMT 5, 486–492 (1982).

    Article  Google Scholar 

  12. Lang, H.D., Bouwhuis, G.: Displacement measurement with a laser interferometer. Philips Tech. Rev., vol. 30, 160–165 (1969).

    Google Scholar 

  13. Thansandote, A., Stuchiy, S.S., Wight, J.S.: Microwave interferometer for measurements of small displacements. IEEE Trans. on Instrumentation and Measurement, vol. IM 31, 227–232 (1982).

    Google Scholar 

  14. Chari, M.V.K., Silvester, P.P. (Ed.); Finite elements in electrical and magnetic field problem, John Wiley & Sons, Chichester, 1979.

    Google Scholar 

  15. Strang, G., Fix, G.J.: An analysis of the finite element method, Prentice-Hall, Englewood, Cliffs, New Jersey, 1973.

    Google Scholar 

  16. Brebbia, C.A.: The boundary element method for engineering, Pentech Press, London, 1978.

    Google Scholar 

  17. Brebbia, C.A.: Progress in boundary element method, vol. I, Pentech Press, London, 1981.

    Google Scholar 

  18. Brebbia, C.A., Walker, S.: Boundary element technique in engineering, Newnes-Butterworths, London, 1980.

    Google Scholar 

  19. Brebbia, C.A., Telles, J., Wrobel, L.: Boundary element technique Theory and applications in engineering. Springer-Verlag, Berlin. NY, 1984.

    Google Scholar 

  20. Brebbia, C.A. (Ed.): Topics in boundary element research I: Basic principles and applications, Springer-Verlag, Berlin. NY, 1984.

    MATH  Google Scholar 

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© 1990 Springer-Verlag Berlin, Heidelberg

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Hirasawa, M., Nakamura, M. (1990). Capacitance of Transducers for Displacement Measurement. In: Brebbia, C.A. (eds) Electrical Engineering Applications. Topics in Boundary Element Research, vol 7. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-48837-5_5

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  • DOI: https://doi.org/10.1007/978-3-642-48837-5_5

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-48839-9

  • Online ISBN: 978-3-642-48837-5

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