Abstract
The present paper deals with the modeling of high resonance frequency electrostatically actuated MEMS accelerometer having out-of-plane sensing axis. The accelerometer is based on folded beam support and comb structure configuration. Capacitance change phenomenon is used to determine the device acceleration. Effect of different structural parameters on the device performance is analyzed and the simulation is carried out on COMSOL Multiphysics, a strong 3D modeling software. The design is based on standard SOI-MUMP’S technology and with in-house fabrication capabilities. SOI-MUMP’S technology is preferred because of its outstanding performance and ease of fabrication.
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Singh, P., Srivastava, P., Verma, R.M., Jaiswal, S. (2013). Modeling of High Frequency Out-of-Plane Single Axis MEMS Capacitive Accelerometer. In: Gaur, M.S., Zwolinski, M., Laxmi, V., Boolchandani, D., Sing, V., Sing, A.D. (eds) VLSI Design and Test. Communications in Computer and Information Science, vol 382. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-42024-5_30
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DOI: https://doi.org/10.1007/978-3-642-42024-5_30
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-42023-8
Online ISBN: 978-3-642-42024-5
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