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Progress in VLSI Design and Test pp 289–299Cite as

Delay Uncertainty in Single- and Multi-Wall Carbon Nanotube Interconnects

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Part of the book series: Lecture Notes in Computer Science ((LNTCS,volume 7373))

Abstract

Carbon nanotube (CNT) has become the promising candidate for replacing the traditional copper based interconnect systems in future VLSI technology nodes. This paper analyzes delay uncertainty due to crosstalk in the Single- and Multi-wall CNT bundle based interconnect systems. Results are compared with traditional copper based interconnect systems. It is shown that the average crosstalk induced delay is within 60.5% over normal interconnect delay for double MWCNT as compared to 76.6% for copper and 72-75.2% for SWCNT and MWCNT bundle based interconnects. The average delay uncertainty with respect to Cu interconnects for SWCNT bundle based interconnect is found to be 75.3% and 84.6% for densely and sparsely packed SWCNT bundles, respectively, whereas it is 84.3% for MWCNT bundle and 61.6% for double MWCNT based interconnects.

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Authors and Affiliations

  1. School of VLSI Technology, Bengal Engineering and Science University, Shibpur, India

    Debaprasad Das & Hafizur Rahaman

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  1. Debaprasad Das
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  2. Hafizur Rahaman
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Editors and Affiliations

  1. Department of Information Technology, Bengal Engineering and Science University Shibpur, P.O. Botanic Garden, 711103, Howrah, India

    Hafizur Rahaman

  2. Department of Electronic Science, University of Calcutta, 92, A.P.C. Road, 700009, Kolkata, India

    Sanatan Chattopadhyay

  3. Department of Electronics and Electrical Comm. Engg., Indian Institute of Technology Kharagpur, 721302, West Bengal, India

    Santanu Chattopadhyay

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Das, D., Rahaman, H. (2012). Delay Uncertainty in Single- and Multi-Wall Carbon Nanotube Interconnects. In: Rahaman, H., Chattopadhyay, S., Chattopadhyay, S. (eds) Progress in VLSI Design and Test. Lecture Notes in Computer Science, vol 7373. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-31494-0_33

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  • DOI: https://doi.org/10.1007/978-3-642-31494-0_33

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-31493-3

  • Online ISBN: 978-3-642-31494-0

  • eBook Packages: Computer ScienceComputer Science (R0)

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