Abstract
This chapter gives an overview about GIZO TFTs, comprising an introductory section about generic TFT structure and operation, different semiconductor technologies for TFTs – with special emphasis on AOSs and particularly on GIZO – and then some experimental results obtained for GIZO TFTs fabricated in CENIMAT. Thin-film transistors (TFTs) are important electronic devices which are predominantly used as On/Off switches in active matrix backplanes of flat panel displays (FPDs), namely liquid crystal displays (LCDs) and organic light emitting device (OLED) displays. Even if a-Si:H is still dominating the TFT market in terms of semiconductor technology, oxide semiconductors are emerging as one of the most promising alternatives for the next generation of TFTs, bringing the possibility of having fully transparent devices, low processing temperature, low cost, high performance and electrically stable properties [1, 2]. Amorphous oxide semiconductors (AOS) such as Gallium–Indium–Zinc oxide (GIZO) [3, 4], even if fabricated at temperatures below 150∘C, are currently capable of providing transistors with field-effect mobility (μFE) exceeding \(20\,{\mathrm{cm}}^{2}\,{\mathrm{V}}^{-1}\,{\mathrm{s}}^{-1}\), threshold voltage (V T) close to 0 V, On/Off ratios above 108, subthreshold swing (S) around 0. 20 V dec−1 and fully recoverable V T shift (ΔV T) lower than 0.5 V after 24 h stress with constant drain current of 10 μA.
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- 1.
V G , V D , I G and I D are used throughout this chapter, given that the source electrode is always assumed to be grounded, but these notations have exactly the same meaning as V GS , V DS , I GS and I DS .
- 2.
Given the broad range of methodologies for V T determination (see, for instance [13]), large ambiguity can arise when comparing different devices using this parameter. As a less ambiguous concept, V on is largely used in literature, simply corresponding to the V G at which I D starts to abruptly increase as seen in a \(log{I}_{D} --{V }_{G}\) plot, or in other words, the V G necessary to fully turn-off the transistor [14].
- 3.
More details about different semiconductor material technologies for TFTs are given in section 2.2.
- 4.
- 5.
Most of the organic TFTs are p-type, i.e., the conduction mechanism is due to holes rather than electrons.
- 6.
Note that the given references are just a few examples of the large number of reported works, with many more being available, specially for the period comprised between 2007 and 2009.
- 7.
Given this effect, which arises as a consequence of the TFT measurement protocol used in this work, hysteresis is not used systematically throughout this chapter to evaluate charge trapping or other instability phenomena on the TFTs, being ΔV on used instead.
- 8.
During our research work we also verified that for the same sputtering conditions, N is always higher for In2O3 than for ZnO films.
- 9.
Note that most of the traps at the dielectric/semiconductor interface should already be filled even if the assumptions of \({\Phi }_{{G}^{-}}{\Phi }_{S} < 0\) and positive charges contained in the dielectric are not valid, because electrons from the high N semiconductor can be captured by the lower energy trap states at that interface.
- 10.
Note that in the case of plasma species containing H + , the incorporation of this element in oxide semiconductors can also form shallow donor states that contribute to the increase of N, as confirmed by first-principle calculations for GIZO [98]. On the other hand, for oxygen containing plasmas, the incorporation of this element can lead to acceptor-like surface states that reestablish the depletion layer close to the oxide semiconductor’s back surface [96, 97, 99].
- 11.
Note that in fig. 16 the Off -current of both nonpassivated and passivated devices is similar, which seems to contradict the results shown in fig. 15b. However, this is an artifact caused by the higher noise level of the measurement system used to obtain the results depicted in fig. 16.
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Acknowledgements
The authors thank the Microelectronic and Optoelectronic Materials Group in CENIMAT. Thanks are also due to the Multiflexioxides Project Consortium (NMP3-CT-2006–032231) and ORAMA Project Consortium (FP7-NMP-2009-LARGE-3). The authors also thank Portuguese Science Foundation (FCT-MCTES) for the funding through the projects PTDC/CTM/73943/2006, PTDC/EEA-ELC/64975/2006 and PTDC/CTM/099124/2008. Thanks are also due to the European Research Council for the ERC 2008 Advanced Grant (INVISIBLE contract number 228144) and IT R&D program of MKE (2006-S079–03, Smart window with transparent electronic devices) from ETRI Korea.
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Barquinha, P., Martins, R., Fortunato, E. (2012). N-Type Oxide Semiconductor Thin-Film Transistors. In: Pearton, S. (eds) GaN and ZnO-based Materials and Devices. Springer Series in Materials Science, vol 156. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-23521-4_15
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