Abstract
This chapter reports the key developments for nanomanufacturing automation. Automated CAD guided nanoassembly can be performed by an improved atomic force microscopy (AFM). Although CAD guided automated manufacturing has been widely studied in the macro-world, nanomanufacturing is challenging. In nanoenvironments, the nanoobjects are usually distributed on a substrate randomly, so the nanoenvironment and the available nanoobjects have to be modeled in order to design a feasible nanostructure. Because of the positioning errors due to the random drift, the actual position of each nanoobject has to be identified by our local scanning method. The advancement of AFM increases the efficiency and accuracy to manipulate and assemble nanoobjects. Besides, the manufacturing process of carbon nanotube (CNT) based nanodevices is discussed. A novel automated manufacturing system has been especially designed for manufacturing nanodevices. The system integrates a new dielectrophoretic (DEP) microchamber into a robotic based deposition workstation and increases the yield to form semi-conducting CNTs for manufacturing nanodevices. Therefore, by using the proposed CNT separation and deposition system, CNT based nanodevices with specific and consistent electronic properties can be manufactured automatically and effectively.
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Abbreviations
- AC:
-
alternating-current
- AFM:
-
atomic force microscopy
- CM:
-
Clausius–Mossotti
- CNT:
-
carbon nanotube
- DC:
-
direct-current
- DEP:
-
dielectrophoretic
- DNA:
-
deoxyribonucleic acid
- IR:
-
infrared
- MEMS:
-
micro-electromechanical system
- MWCNT:
-
multi-walled carbon nanotube
- NEMS:
-
nanoelectromechanical system
- PECVD:
-
plasma enhanced chemical vapor deposition
- SEM:
-
scanning electron microscopy
- SEM:
-
strategic enterprise management
- SWCNT:
-
single-walled carbon nanotube
- UV:
-
ultraviolet
- VOD:
-
virtual-object-destination
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Xi, N., Lai, K.W.C., Chen, H. (2009). Nanomanufacturing Automation. In: Nof, S. (eds) Springer Handbook of Automation. Springer Handbooks. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-78831-7_53
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DOI: https://doi.org/10.1007/978-3-540-78831-7_53
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