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Embedded Passives

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Materials for Advanced Packaging

Abstract

Emerging portable smart devices with more functionality demands high-performance, smaller, lighter, thinner, and cheaper electronic components. This is enabled by the transformation of today’s surface-mounted discrete passives such as resistors, capacitors, and inductors as thin films embedded in the package substrate or buildup layers. Such a trend would lead to miniaturized and more efficient power systems.

This chapter reviews the fundamentals of materials, designs, and processes for each of these thin-film passive component technologies, particularly focusing on power applications. It then describes the challenges and recent advances in each of these areas.

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Acknowledgements

The authors wish to thank National Science Foundation, Intel Corporation, and Stanford Graduate Fellowship (L. Li) for the financial support which made this work possible. Helpful collaborations with and previous work by A. M. Crawford, D. Gardner, G. Vandentop, H. Braunisch, R. Nair, K-P Hwang, Y. Min, M. Mao, T. Schneider, and R. Bubber, and a software license from Ansoft are also gratefully acknowledged.

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Authors and Affiliations

  1. Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA

    Pulugurtha Markondeya Raj, Parthasarathi Chakraborti, Himani Sharma, Shubham Jain & Rao Tummala

  2. Department of Materials Science and Engineering, Stanford University, Stanford, CA, USA

    Dok Won Lee Ph.D. & Shan Xiang Wang Ph.D.

  3. Tsinghua University, Beijing, China

    Liangliang Li Ph.D.

Authors
  1. Pulugurtha Markondeya Raj
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  2. Dok Won Lee Ph.D.
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  3. Liangliang Li Ph.D.
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  4. Shan Xiang Wang Ph.D.
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  5. Parthasarathi Chakraborti
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  6. Himani Sharma
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  7. Shubham Jain
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  8. Rao Tummala
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Corresponding author

Correspondence to Pulugurtha Markondeya Raj .

Editor information

Editors and Affiliations

  1. Henkel China Co., Ltd, Shanghai, Shanghai, China

    Daniel Lu

  2. Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA

    C.P. Wong

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Raj, P.M. et al. (2017). Embedded Passives. In: Lu, D., Wong, C. (eds) Materials for Advanced Packaging. Springer, Cham. https://doi.org/10.1007/978-3-319-45098-8_13

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  • DOI: https://doi.org/10.1007/978-3-319-45098-8_13

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-45097-1

  • Online ISBN: 978-3-319-45098-8

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