Abstract
Global digitisation and availability of affordable and advanced electrical and electronic equipment (EEE) have aggravated the management problem of waste electrical and electronic equipment (WEEE) or electronic waste (e-waste) around the world. According to a report published by Baldé et al. (2017), global electronic waste (e-waste) generation in the year 2016 is estimated to be 44.7 Mt and projected to grow to 52.2 Mt by 2021. EEE has been categorised into two categories: (a) Information technology and telecommunication (IT and telecom) equipment and (b) consumer electrical and electronics (e-waste management rules, 2016). End-of-life mobile phones (Eol-MPs) are contributing a major portion in e-waste content because of its high obsolescence rate and ever-increasing consumer base and year-wise sales as shown in Fig. 1 (Beigl et al., 2012; Kasper et al., 2011; Monteiro et al., 2007; Osibanjo and Nnorom, 2008; Robinson, 2009). Printed circuit board (PCB) is the core component of any EEE so as of end-of-life mobile phone (EoL-MP). Metal recycling from the PCBs of EoL-MP as a secondary resource has become a necessity both from an economical and environmental point of view considering the abundant presence of base, precious and toxic metals in them.
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Gupta, N., Trivedi, A., Hait, S. (2021). Column Leaching of Metals from PCB of End-of-Life Mobile Phone Using DTPA Under Oxidising Condition. In: Kalamdhad, A.S. (eds) Integrated Approaches Towards Solid Waste Management . Springer, Cham. https://doi.org/10.1007/978-3-030-70463-6_22
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DOI: https://doi.org/10.1007/978-3-030-70463-6_22
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