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Advanced Flip Chip Packaging

  • Book
  • © 2013

Overview

Editors:
  1. Ho-Ming Tong

    1. ASE Group, Kaohsiung, Taiwan R.O.C.

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  2. Yi-Shao Lai

    1. ASE Group, Kaohsiung, Taiwan R.O.C.

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    You can also search for this editor in PubMed   Google Scholar

  3. C.P. Wong

    1. , Department of Engineering, The Chinese University of Hong Kong, Hong Kong, SAR, China, People's Republic

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  • Broad-ranging chapters with a focus on IC-package-system integration
  • Provides viewpoints from leading industry executives and experts
  • Details state-of-the-art achievements in process technologies and scientific research
  • Presents a clear development history and touches on trends in the industry, while also discussing up-to-date technology information

  • 62k Accesses

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About this book

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

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Table of contents (11 chapters)

  1. Front Matter

    Pages i-vii
    Download chapter PDF

  2. Market Trends: Past, Present, and Future

    • Robert Lanzone
    Pages 1-21

  3. Technology Trends: Past, Present, and Future

    • Eric Perfecto, Kamalesh Srivastava
    Pages 23-52

  4. Bumping Technologies

    • Michael Töpper, Daniel Lu
    Pages 53-84

  5. Flip-Chip Interconnections: Past, Present, and Future

    • Sung-Kwon Kang, Da-Yuan Shih, William E. Bernier
    Pages 85-154

  6. Flip Chip Underfill: Materials, Process, and Reliability

    • Zhuqing Zhang, Shijian Luo, C. P. Wong
    Pages 155-199

  7. Conductive Adhesives for Flip-Chip Applications

    • Daoqiang Daniel Lu, C. P. Wong
    Pages 201-261

  8. Substrate Technology

    • Yutaka Tsukada
    Pages 263-339

  9. IC-Package-System Integration Design

    • Yiyu Shi, Yang Shang, Hao Yu, Shauki Elassaad
    Pages 341-412

  10. Thermal Management of Flip Chip Packages

    • Richard C. Chu, Robert E. Simons, Madhusudan Iyengar, Lian-Tuu Yeh
    Pages 413-469

  11. Thermo-mechanical Reliability in Flip-Chip Packages

    • Li Li, Hongtao Ma
    Pages 471-501

  12. Interfacial Reactions and Electromigration in Flip-Chip Solder Joints

    • C. E. Ho, C. R. Kao, K. N. Tu
    Pages 503-560
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Editors and Affiliations

  • ASE Group, Kaohsiung, Taiwan R.O.C.

    Ho-Ming Tong, Yi-Shao Lai

  • , Department of Engineering, The Chinese University of Hong Kong, Hong Kong, SAR, China, People's Republic

    C.P. Wong

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