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A New Method for Local Strain Field Analysis Near Cracks in Micro- and Nanotechnology Applications

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Fracture of Nano and Engineering Materials and Structures

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Abstract

The paper presents a new reliability approach based on local stress and deformation analysis by means of digital image correlation methods. The so-called nanoDAC- (deformation analysis by correlation technique) method is applied in connection with creep and fatigue crack evaluation concepts. This will lead to improved lifetime estimations of microsolder joints in electronic packaging and in MEMS and NEMS interconnection technologies as well.

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References

  1. Vogel, D., Sabaté, N., Wunderle, B., Keller, J., Michel, B., Reichl, H., Nanoreliability for Mechanically Loaded Devices, Int. Congress of Nanotechnology 2005 (ICN 2005), San Francisco, USA, 1–4 Nov. 2005.

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  2. Michel, B., Keller, J, NanoDAC — a New Technique for Micro-and Nanomechanical Reliability Analysis of Lead-free Solder Interconnects, Int. Conf. on Lead-Free Soldering, Toronto, Canada, 24–26 May 2005.

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  3. Michel, B., Testing at Micro and Nanoscale, EuroSIME, European Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics, Berlin, 18–20 April 2005.

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  4. Auersperg, J., Vogel, D., Michel, B., Crack and delamination risk evaluation of thin silicon based microelectronic devices, 11th Int. Conf. on Fracture (ICF 11) Torino, 20–25 March 2005.

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Author information

Authors and Affiliations

  1. Fraunhofer Institute for Reliability and Microintegration IZM Berlin, Berlin

    D. Vogel

  2. University of Barcelona, Barcelona

    N. Sabate

  3. Infineon Technologies AG Dresden, Gustav-Meyer-Allee 25, D-13355, Berlin, Germany

    D. Lieske

Authors
  1. B. Michel
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  2. D. Vogel
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  3. N. Sabate
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  4. D. Lieske
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Editor information

Editors and Affiliations

  1. Dept of Civil Engineering, Democritus University of Thrace, Xanthi, Greece

    E. E. Gdoutos

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© 2006 Springer

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Cite this paper

Michel, B., Vogel, D., Sabate, N., Lieske, D. (2006). A New Method for Local Strain Field Analysis Near Cracks in Micro- and Nanotechnology Applications. In: Gdoutos, E.E. (eds) Fracture of Nano and Engineering Materials and Structures. Springer, Dordrecht. https://doi.org/10.1007/1-4020-4972-2_361

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  • DOI: https://doi.org/10.1007/1-4020-4972-2_361

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-1-4020-4971-2

  • Online ISBN: 978-1-4020-4972-9

  • eBook Packages: EngineeringEngineering (R0)

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