Torsional deformation is regarded a promising deformation procedure to prepare the gradient structural materials. Pure copper was subjected to large plastic strains in torsion. Electron backscatter diffraction analysis was used to explore the microstructure evolution. The observations demonstrate that both high-angle grain boundaries and misorientation increase with strain. The grains finer and more homogeneous. In addition, the microstructure within the shear band demonstrates a distinct preferred orientation. The crystal <110> direction is parallel to the shear direction, and the crystal {111} inclines to the plane shear surface. A torsion-induced bar specimen includes a {011} <211> brass texture, {011} <100> Gaussian texture, and stronger {112} <111> copper texture.
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Acknowledgments
This work was partially supported by National Natural Science Foundation of China (No. 51275414, No. 51172161, No. 51405136, and No. 51505191), School Youth Foundation (No. 1205-04020202), the fund of the State Key Laboratory of Solidification Processing in NWPU (No. SKLSP201517), and Doctor Foundation of Henan Polytechnic University (No. B2015-37).
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Translated from Problemy Prochnosti, No. 1, pp. 106 – 111, January – February, 2018.
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Wang, C.P., Fan, J.K., Li, F.G. et al. Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper Under Torsional Deformation. Strength Mater 50, 92–97 (2018). https://doi.org/10.1007/s11223-018-9946-0
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DOI: https://doi.org/10.1007/s11223-018-9946-0