Abstract
Copper nanoparticles are promising materials for the development of low-cost, low-temperature processable materials for the interconnection technology. Owing to its low price, copper is expected to replace silver in many applications; however, it suffers from its proneness to oxidation, in particular for nanoparticles due to the high surface-to-volume ratio. In this study, we report the synthesis and the characterization by SEM, TEM-EDS, XRD, and TGA of several Cu-based core-shell nanoparticles. We show that their thermal stability in air towards oxidation can be highly enhanced thanks to a simple core–shell fabrication process. Best results were obtained with thermally post-treated 6-nm-silver-thick shells, which allow to improve the oxidation onset temperature up to 206 °C.
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Acknowledgments
The authors are grateful to S. Desrousseaux for TGA-DSC expertise and S. Yahiaoui for atomic absorption measurements.
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Michaud, T., Nobre, S.S., Baffie, T. et al. High-temperature stability of copper nanoparticles through Cu@Ag nanostructures. J Nanopart Res 21, 116 (2019). https://doi.org/10.1007/s11051-019-4567-5
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DOI: https://doi.org/10.1007/s11051-019-4567-5