Abstract
In this study, B2O3–SiO2–ZnO–BaO (BSZB) glass-coated copper particles were prepared by sol–gel process for use in copper pastes. The pastes with different ratio of BSZB glass were sintered at temperatures ranging from 850 to 910 °C with low temperature co-fired ceramic (LTCC) substrate. When pastes prepared from 1 wt% glass-coated copper powder were sintered at 910 °C, both a dense copper film and a dense LTCC structure were obtained. At this condition, the film had a thickness of approximately 15 μm and a sheet resistance of 1.9 mΩ/□, and a good bonding behavior between copper film and LTCC substrate was also observed.
Similar content being viewed by others
References
A. Okada, T. Ogihara, Sintering behavior of silver particles in electrode for multilayer ceramic substrate. Key Eng. Mater. 421–422, 289–292 (2010)
J. Bangali, S. Rane, G. Phatak, S. Gangal, Silver thick film pastes for low temperature co-fired ceramics: impact of glass frit variation. Solder. Surf. Mt. Technol. 20, 41–46 (2008)
J.H. Jean, C.R. Chang, Camber development during cofiring Ag-based low-dielectric-constant ceramic package. J. Mater. Res. 12, 2743–2749 (1997)
Y. Wang, Y. Liu, J. Ma, Z. Dong, M. Yin, Preparation and sintering behavior of Au conductor pastes for LTCC substrate. Mater. Sci. Forum 475–479, 1763–1766 (2005)
K.C. Feng, C.C. Chou, C.S. Chen, L.W. Chu, Phase evolution and electrical properties of copper-electroded BaTi4O9 materials with BaO–ZnO–B2O3–SiO2 glass system in reducing atmosphere. Ceram. Int. 39, S321–S324 (2013)
C.C. Chou, C.S. Chen, P.C. Wu, K.C. Feng, L.W. Chu, Influence of glass compositions on the microstructure and dielectric properties of low temperature fired BaTi4O9 microwave material with copper electrodes in reducing atmosphere. Ceram. Int. 38S, S159–S162 (2012)
S. Wu, Preparation of fine copper powder using ascorbic acid as reducing agent and its application in MLCC. Mater. Lett. 61, 1125–1129 (2007)
M. Biçer, İ. Şişman, Controlled synthesis of copper nano/microstructures using ascorbic acid in aqueous CTAB solution. Powder Technol. 198, 279–284 (2010)
M. Jakubowska, M. Jarosz, K. Kiełbasinski, A. Młozniak, New conductive thick-film paste based on silver nanopowder for high power and high temperature applications. Microelectron. Reliab. 51, 1235–1240 (2011)
X. Xu, H. Zhuang, W. Li, G. Jiang, Bonding behavior of copper thick films containing lead-free glass frit on aluminum nitride substrates. Ceram. Int. 30, 661–665 (2004)
L.Q. Pham, J.H. Sohn, J.H. Park, H.S. Kang, B.C. Lee, Y.S. Kang, Comparative study on the preparation of conductive copper pastes with copper nanoparticles prepared by electron beam irradiation and chemical reduction. Radiat. Phys. Chem. 80, 638–642 (2011)
Y.J. Hong, D.S. Jung, H.Y. Koo, J.H. Kim, Y.N. Ko, Y.C. Kang, Characteristics of ZnO–B2O3–SiO2–CaO glass frits prepared by spray pyrolysis as inorganic binder for Cu electrode. J. Alloys Compd. 509, 8077–8081 (2011)
Q. Che, H. Yang, L. Lu, Y. Wang, Preparation of lead-free nanoglass frit powder for crystalline silicon solar cells. Appl. Energy 112, 657–662 (2013)
L. Wang, Y. Wang, D.-A. Yang, Glass binder in thick film metallization paste for AlN. Key Eng. Mater. 434–435, 366–368 (2010)
Y. Kobayashia, H. Katakami, E. Mine, D. Nagao, M. Konno, Silica coating of silver nanoparticles using a modified Stöber method. J. Colloid Interface Sci. 283, 392–396 (2005)
D.S. Seo, S.H. Park, J.K. Lee, Sinterability and conductivity of silver paste with Pb-free frit. Curr. Appl. Phys. 9, S72–S74 (2009)
S.Y. Chen, C.H. Chou, S.Y. Cheng, Effect of metal oxide precursor on sintering shrinkage, microstructure evolution and electrical properties of silver-based pastes. J. Mater. Sci. 37, 169–175 (2002)
S.J. Lee, W.M. Kriven, J.H. Park, Y.S. Yoon, Bonding behavior of Cu/CuO thick film on a low-firing ceramic substrate. J. Mater. Res. 12, 2411–2417 (1997)
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Chen, J., Yang, D., Zhai, T. et al. Influence of B2O3–SiO2–ZnO–BaO glass ratio and sintering temperature on the microstructure and property of copper thick film for low temperature co-fired ceramic. J Mater Sci: Mater Electron 27, 1929–1937 (2016). https://doi.org/10.1007/s10854-015-3975-2
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10854-015-3975-2