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Reliability testing of nano-particle system packaging

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Abstract

Metal nanoparticle applications in nanoelectronics are based on single nanodots or 1-D nanodot chains (both for single electron transistors), or 2-D discontinuous metal thin film (DMTF) arrays (e.g. for sensors), or 3-D polymer or ceramic “cermets,” (for high resistivity resistors and high-k dielectrics). DMTF fabrication relies upon weak substrate adhesion for discrete island formation, which promotes long-term instability and reliability problems. Past work on DMTF nanodot stability is applicable to future nanoelectronics and nanopackaging.

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  1. Department of Electrical and Computer Engineering, Portland State University, Portland, OR, 97207-0751, USA

    James E. Morris

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  1. James E. Morris
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Correspondence to James E. Morris.

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Morris, J.E. Reliability testing of nano-particle system packaging. Microsyst Technol 15, 139–143 (2009). https://doi.org/10.1007/s00542-008-0654-8

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  • DOI: https://doi.org/10.1007/s00542-008-0654-8

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