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Chemical mechanical paired grinding: a tool for multi-wavelength planarization

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Abstract

A new planarization method, chemical mechanical paired grinding (CMPG), is developed by combining strengths of grinding and polishing while avoiding their weaknesses. Surface waviness, a key performance index, is significantly influenced by the induced obliqueness ratio (transverse feed velocity to polishing/grinding wheel velocity) of the CMPG process. The window of planarized wavelengths expanded significantly with increasing obliqueness ratio, while MRR could be enhanced by adjusting rotational speeds of the wheel pair. This endows CMPG with global planarization capabilities, while potentially obviating the MRR vs. planarization efficiency trade-off typical of either fixed abrasive grinding of free abrasive CMP processes.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Iowa State University, Ames, IA, USA

    Abhijit Chandra, Ashraf F. Bastawros & David T. Asplund

  2. Department of Aerospace Engineering, Iowa State University, Ames, IA, USA

    Abhijit Chandra, Ashraf F. Bastawros & Tianyu Yu

Authors
  1. Abhijit Chandra
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  2. Ashraf F. Bastawros
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  3. Tianyu Yu
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  4. David T. Asplund
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Correspondence to Abhijit Chandra.

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Chandra, A., Bastawros, A.F., Yu, T. et al. Chemical mechanical paired grinding: a tool for multi-wavelength planarization. Int J Adv Manuf Technol 89, 611–617 (2017). https://doi.org/10.1007/s00170-016-9085-3

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  • DOI: https://doi.org/10.1007/s00170-016-9085-3

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